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Subthreshold current reduction for decoded-driver by self-reverse biasing (DRAMs)

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TLDR
In this paper, the authors presented an analytical expression for sub-threshold current reduction in a decoded-driver by self-reverse biasing, which is inherently required for low-voltage, low-power, high-speed DRAM's for portable equipment.
Abstract: 
Analytical expressions are presented for subthreshold current reduction in a decoded-driver by self-reverse biasing, which is inherently required for low-voltage, low-power, high-speed DRAM's for portable equipment. The scheme involves inserting a switching MOS transistor between the driver circuits and its power supply line. The subthreshold current of the decoded-driver is reduced to the order of 10/sup -3/ in the practical temperature range (250-350 K) with 254 mV of self-reverse biasing voltage, while the delay time is only 3% more than in conventional schemes. The transition time of 1 ms from the operating state to the low subthreshold current state is sufficient to reduce the subthreshold current. The rapid recovery time of 1 ns from the low subthreshold current state does not interrupt the start of normal operation. The subthreshold current reduction was confirmed experimentally using a test chip fabricated with 0.25- mu m technology. >

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Citations
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Journal ArticleDOI

1-V power supply high-speed digital circuit technology with multithreshold-voltage CMOS

TL;DR: In this article, a multithreshold-voltage CMOS (MTCMOS) based low-power digital circuit with 0.1-V power supply high-speed low power digital circuit technology was proposed, which has brought about logic gate characteristics of a 1.7ns propagation delay time and 0.3/spl mu/W/MHz/gate power dissipation with a standard load.
Journal ArticleDOI

Dual-threshold voltage techniques for low-power digital circuits

TL;DR: In this article, the authors present several dual-threshold voltage techniques for reducing standby power dissipation while still maintaining high performance in static and dynamic combinational logic blocks MTCMOS sleep transistor sizing issues are addressed, and a hierarchical sizing methodology based on mutual exclusive discharge patterns is presented.
Proceedings ArticleDOI

Estimation of standby leakage power in CMOS circuits considering accurate modeling of transistor stacks

TL;DR: Results on a large number of benchmarks indicate that proper input selection can reduce the standby leakage power by more than 50% for some circuits.
Journal ArticleDOI

Spin-transfer torque RAM technology: Review and prospect

TL;DR: This paper reviews the development of MTJ device technology and formulates considerations regarding its memory application, including SPRAM memory cell structure and operation, write voltage limitation, and thermal stability.
Proceedings ArticleDOI

Subthreshold leakage modeling and reduction techniques

TL;DR: In this paper, an overview of current research to control leakage currents, with an emphasis on areas where CAD improvements will be needed, is given, and techniques to model sub-reshold leakage currents at the device, circuit, and system levels.
References
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Proceedings Article

Physics of semiconductor devices

S. M. Sze
Journal ArticleDOI

Subthreshold conduction in MOSFET's

TL;DR: With the application of substrate bias, it is concluded from the data and the theory that two-dimensional effects can cause dramatic increases in the drain conductance to confirm the theory over a wide range of drain and gate voltages.
Journal ArticleDOI

Microprocessors circa 2000

TL;DR: The authors propose a new law of computing and semiconductors: 'every concept proved useful in mainframe or minicomputers has migrated or will migrate onto the microprocessor'.
Journal ArticleDOI

Performance and hot-carrier effects of small CRYO-CMOS devices

TL;DR: In this article, the performance characteristics of submicrometer CMOS devices operating at low/cryogenic temperatures (CRYO-CMOS) are determined, in relation to the velocity saturation, source-drain resistances, mobility behavior, carrier freeze-out effects, hot-carrier effects, and circuit performance.
Journal ArticleDOI

A 1.5 V DRAM for battery-based applications

TL;DR: In this article, a 3.4-m/sup 2/data-line shielded stacked capacitor (STC) cell is proposed to enhance signal-to-noise ratio (SNR) in memory cell array.
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