L
L. Pipes
Researcher at Intel
Publications - 6
Citations - 2682
L. Pipes is an academic researcher from Intel. The author has contributed to research in topics: PMOS logic & NMOS logic. The author has an hindex of 5, co-authored 5 publications receiving 2463 citations.
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Proceedings ArticleDOI
A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging
Kaizad Mistry,C. Allen,C. Auth,B. Beattie,Daniel B. Bergstrom,M. Bost,M. Brazier,M. Buehler,Annalisa Cappellani,R. Chau,C. H. Choi,G. Ding,K. Fischer,Tahir Ghani,R. Grover,W. Han,D. Hanken,M. Hattendorf,J. He,J. Hicks,R. Huessner,D. Ingerly,Pulkit Jain,R. James,L. Jong,Subhash M. Joshi,C. Kenyon,K. Kuhn,K. Lee,Huichu Liu,J. Maiz,B. Mclntyre,P. Moon,J. Neirynck,S. Pae,C. Parker,D. Parsons,Chetan Prasad,L. Pipes,M. Prince,Pushkar Ranade,T. Reynolds,J. Sandford,Lucian Shifren,J. Sebastian,J. Seiple,D. Simon,Swaminathan Sivakumar,Pete Smith,C. Thomas,T. Troeger,P. Vandervoorn,S. Williams,K. Zawadzki +53 more
TL;DR: In this paper, a 45 nm logic technology is described that for the first time incorporates high-k + metal gate transistors in a high volume manufacturing process, resulting in the highest drive currents yet reported for NMOS and PMOS.
Proceedings ArticleDOI
A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors
C. Auth,C. Allen,A. Blattner,Daniel B. Bergstrom,Mark R. Brazier,M. Bost,M. Buehler,V. Chikarmane,Tahir Ghani,Timothy E. Glassman,R. Grover,W. Han,D. Hanken,Michael L. Hattendorf,P. Hentges,R. Heussner,J. Hicks,D. Ingerly,Pulkit Jain,S. Jaloviar,Robert James,David Jones,J. Jopling,Subhash M. Joshi,C. Kenyon,Huichu Liu,R. McFadden,B. McIntyre,J. Neirynck,C. Parker,L. Pipes,Ian R. Post,S. Pradhan,M. Prince,S. Ramey,T. Reynolds,J. Roesler,J. Sandford,J. Seiple,Pete Smith,Christopher D. Thomas,D. Towner,T. Troeger,Cory E. Weber,P. Yashar,K. Zawadzki,Kaizad Mistry +46 more
TL;DR: In this paper, a 22nm generation logic technology is described incorporating fully-depleted tri-gate transistors for the first time, which provides steep sub-threshold slopes (∼70mV/dec) and very low DIBL ( ∼50m V/V).
Proceedings ArticleDOI
A 14nm logic technology featuring 2 nd -generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588 µm 2 SRAM cell size
Sanjay Natarajan,M. Agostinelli,S. Akbar,M. Bost,A. Bowonder,V. Chikarmane,S. Chouksey,A. Dasgupta,K. Fischer,Q. Fu,Tahir Ghani,M. Giles,S. Govindaraju,R. Grover,W. Han,D. Hanken,E. Haralson,M. Haran,M. Heckscher,R. Heussner,Pulkit Jain,R. James,R. Jhaveri,I. Jin,Hei Kam,Eric Karl,C. Kenyon,Mark Y. Liu,Y. Luo,R. Mehandru,S. Morarka,L. Neiberg,Paul A. Packan,A. Paliwal,C. Parker,P. Patel,R. Patel,C. Pelto,L. Pipes,P. Plekhanov,M. Prince,S. Rajamani,J. Sandford,Sell Bernhard,Swaminathan Sivakumar,Pete Smith,B. Song,K. Tone,T. Troeger,J. Wiedemer,M. Yang,Kevin Zhang +51 more
TL;DR: In this paper, a 14nm logic technology using 2nd-generation FinFET transistors with a novel subfin doping technique, self-aligned double patterning (SADP) for critical patterning layers, and air-gapped interconnects at performance-critical layers is described.
Proceedings ArticleDOI
A 32nm logic technology featuring 2 nd -generation high-k + metal-gate transistors, enhanced channel strain and 0.171μm 2 SRAM cell size in a 291Mb array
Sanjay Natarajan,Mark Armstrong,M. Bost,Ruth A. Brain,Mark R. Brazier,C.-H. Chang,V. Chikarmane,Michael A. Childs,H. Deshpande,K. Dev,G. Ding,Tahir Ghani,Oleg Golonzka,W. Han,Jun He,R. Heussner,Robert James,I. Jin,C. Kenyon,S. Klopcic,Seung Hwan Lee,Mark Y. Liu,S. Lodha,B. McFadden,Anand Portland Murthy,L. Neiberg,J. Neirynck,Paul A. Packan,S. Pae,C. Parker,C. Pelto,L. Pipes,J. Sebastian,J. Seiple,Sell Bernhard,Swaminathan Sivakumar,B. Song,K. Tone,T. Troeger,Cory E. Weber,M. Yang,Yeoh Andrew W,Kevin Zhang +42 more
TL;DR: In this paper, a 32 nm generation logic technology is described incorporating 2nd-generation high-k + metal-gate technology, 193 nm immersion lithography for critical patterning layers, and enhanced channel strain techniques.
Proceedings ArticleDOI
High performance 32nm logic technology featuring 2 nd generation high-k + metal gate transistors
Paul A. Packan,S. Akbar,Mark Armstrong,Daniel B. Bergstrom,Mark R. Brazier,H. Deshpande,K. Dev,G. Ding,Tahir Ghani,Oleg Golonzka,W. Han,Jun He,R. Heussner,Robert James,J. Jopling,C. Kenyon,S-H. Lee,Mark Y. Liu,S. Lodha,B. Mattis,Anand Portland Murthy,L. Neiberg,J. Neirynck,S. Pae,C. Parker,L. Pipes,J. Sebastian,J. Seiple,Sell Bernhard,Abhishek Sharma,Swaminathan Sivakumar,B. Song,A. St. Amour,K. Tone,T. Troeger,Cory E. Weber,Kevin Zhang,Y. Luo,Sanjay Natarajan +38 more
TL;DR: In this article, a 32nm logic technology for high performance microprocessors is described, and the impact of SRAM cell and array size on Vccmin is reported, including the effect of array size and cell cell cell size.