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Journal ArticleDOI

Elimination of GeO2 and Ge3N4 interfacial transition regions and defects at n-type Ge interfaces: A pathway for formation of n-MOS devices on Ge substrates

TLDR
In this article, the authors identify the source of significant electron trapping at interfaces between n-Ge or inverted p-Ge, and Ge oxide, nitride and oxynitride ITRs.
About
This article is published in Applied Surface Science.The article was published on 2008-09-30. It has received 24 citations till now. The article focuses on the topics: Equivalent oxide thickness & Band offset.

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Citations
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Journal ArticleDOI

High-Mobility Ge N-MOSFETs and Mobility Degradation Mechanisms

TL;DR: In this article, the authors investigated the mechanisms responsible for poor Ge NMOS performance in the past with detailed gate dielectric stack characterizations and Hall mobility analysis, and they identified the major mechanisms behind poor GeNMOS performance have not been completely understood yet.
Journal ArticleDOI

Radical oxidation of germanium for interface gate dielectric GeO2 formation in metal-insulator-semiconductor gate stack

TL;DR: In this paper, a slot-plane-antenna (SPA) high density radical oxidation was used to grow a metal-oxide-semiconductor (Al2O3) gate stack with a GeO2 interfacial layer.
Proceedings ArticleDOI

Experimental demonstration of high mobility Ge NMOS

TL;DR: In this paper, a gate stack engineered with ozone-oxidation is integrated with low temperature S/D activation to fabricate Ge NMOS and the highest electron mobility is demonstrated experimentally, ∼ 1.5 times the universal Si mobility.
Journal ArticleDOI

Atomic structure, electronic structure, and band offsets at Ge:GeO:GeO2 interfaces

TL;DR: In this paper, the band gaps of GeO2 and GeO are calculated using hybrid density functionals that do not require band gap corrections, and the atomic structure of solid GeO is found to have threefold coordinated Ge and O sites with planar oxygen sites.
Journal ArticleDOI

Uniaxial Stress Engineering for High-Performance Ge NMOSFETs

TL;DR: In this article, the uniaxial stress effect on Ge NMOSFETs was experimentally and theoretically investigated, and the physical mechanism of mobility enhancement under such strain indicates that the device performance of GeNMOSFets in the ballistic transport regime can achieve as much as 48% drive current gain beyond the 15 nm technology node.
References
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Journal ArticleDOI

Nanoscale germanium MOS Dielectrics-part I: germanium oxynitrides

TL;DR: In this article, a nanoscale germanium (Ge) oxynitride dielectrics are investigated for Ge MOS device applications, and the synthesizing methodology and physical properties of these OxNitride films have been examined first.
Journal ArticleDOI

Gate dielectric formation and MIS interface characterization on Ge

TL;DR: In this article, the physical and electrical properties of Ge MIS interfaces fabricated by direct oxidation and nitridation of Ge surfaces are reviewed and compared on gate stacks composing of HfO"2 and the nitrided Ge surfaces.
Journal ArticleDOI

Nanoscale germanium MOS Dielectrics-part II: high-/spl kappa/ gate dielectrics

TL;DR: In this paper, atomic layer deposition (ALD) and ultraviolet ozone oxidation (UVO) of zirconium and hafnium oxides are investigated for high-kappa dielectric preparation in Ge MOS devices from the perspectives of thermodynamic stability and electrical characteristics.
Journal ArticleDOI

Ultraviolet and infrared absorption of fused Germania

TL;DR: In this paper, the energy gap for fused germania is shown to be slightly higher than a value published for hexagonal germanium dioxide, which indicates the latter is probably in error.
Journal ArticleDOI

Optical properties of GeO2 in the ultraviolet region

TL;DR: The optical constants of amorphous and crystalline GeO2 were determined by measurements of reflectivity in the region of phonon energy 0·5−25 eV and subsequent use of Kramers-Kronig analysis as discussed by the authors.
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