Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
TL;DR: High power pulsed magnetron sputtering (HPPMS) is an emerging technology that has gained substantial interest among academics and industrials alike as discussed by the authors, also known as HIPIMS (high power impulse...
Book
Handbook of physical vapor deposition (PVD) processing
TL;DR: Physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing is discussed in this paper.
Journal ArticleDOI
Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
William D. Nix,Bruce M. Clemens +1 more
TL;DR: In this paper, the authors examined the stress associated with crystallite coalescence during the initial stages of growth in thin polycrystalline films with island growth morphology and predicted large tensile stresses in agreement with experimental results.
Journal ArticleDOI
Review of advances in cubic boron nitride film synthesis
TL;DR: A review of recent developments in BN film synthesis and characterization can be found in this paper, where the key experimental parameters controlling cBN film formation and synthesis techniques are discussed and the proposed mechanisms of cBN formation and the observed mechanical and electrical properties of CBN films are analyzed.
Journal ArticleDOI
Design and evaluation of tribological coatings
TL;DR: The use of coatings to improve the tribological properties of components such as tools for metal cutting and forming, and machine elements e.g. sliding bearings, seals and valves is constantly increasing.
References
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Journal ArticleDOI
Model for ion-assisted thin-film densification
TL;DR: In this article, a theoretical model to explain the densification of thin films by ion assistance is described, which takes advantage of previously developed fast methods for three-dimensional Monte Carlo cascade computations and assumes a low thermal adatom mobility.
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Effect of ion bombardment during deposition on the x‐ray microstructure of thin silver films
TL;DR: In this paper, the effect of argon ion bombardment on the microstructure of several tens of nanometers thick Ag films was analyzed by x-ray powder diffraction method, which showed that Ar ion bombardment not only influenced the film growth process but had a significant effect on the structure of the resulting films.
Journal ArticleDOI
The ionic entrapment and thermal desorption of inert gases in tungsten for kinetic energies of 40 ev to 5 kev
TL;DR: A clean polycrystalline tungsten wire was bombarded with monoenergetic ions of neon, argon, krypton, and xenon in the energy range 40'ev to 5'kev.
Journal ArticleDOI
Modification of evaporated chromium by concurrent ion bombardment
D. W. Hoffman,M. R. Gaerttner +1 more
TL;DR: In this paper, it was shown that the ion peening transition may be controlled by the transfer of momentum to the depositing film, which is consistent with results obtained in low-pressure, cylindrical post-magnetron sputtering.
Journal ArticleDOI
Model for columnar microstructure of thin solid films.
Seth Lichter,Jyhmin Chen +1 more
TL;DR: The theory substantiates the empirical suggestion that adatom mobility is an important parameter governing column development and predicts that columns occur only at low substrate temperature.