Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Young's Modulus and Coefficient of Linear Thermal Expansion of ZnO Conductive and Transparent Ultra-Thin Films
TL;DR: In this article, a new technique for measuring Young's modulus of an ultra-thin film, with a thickness in the range of about 10nm, was developed by combining an optical lever technique and X-ray diffraction for measuring the strain in the film, which has become the focus of significant attention as a substitute material for indium-tin-oxide transparent electrodes.
Journal ArticleDOI
Stresses in Multilayered Thin Films
TL;DR: In this article, the authors proposed a method to measure the curvature of the surface of a film-substrate system using a monochromatic x-ray beam incident onto a curved single crystal, where the diffraction condition satisfied only for regions of the crystal where the inclination angle with respect to the incident beam exactly matches the Bragg angle.
Journal ArticleDOI
Residual stress characterization of Al/SiC nanoscale multilayers using X-ray synchrotron radiation
TL;DR: In this paper, the residual stresses in model metal-ceramic Al/SiC nanoscale multilayers produced by physical vapor deposition (magnetron sputtering) were studied.
Journal ArticleDOI
Effects of thermal annealing on C/FePt granular multilayers : in situ and ex situ studies
David Babonneau,Gregory Abadias,Johann Toudert,Thierry Girardeau,E. Fonda,J. S. Micha,Frédéric Petroff +6 more
TL;DR: In this paper, the effects of thermal annealing on the structural and magnetic properties of C/FePt granular multilayers were investigated by using dedicated ex situ and in situ techniques, including high-resolution transmission electron microscopy, extended x-ray absorption fine structure, magnetometry, and coupled grazing incidence small-angle xray scattering and X-ray diffraction.
Journal ArticleDOI
Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD
TL;DR: In this paper, three groups of copper films were deposited on the surfaces of the Si (100) crystal by both metal vapor vacuum arc (MEVVA) ion implantation and ion beam assistant deposition (IBAD) technologies.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.