Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
Tailoring the stress-depth profile in thin films; the case of γ’-Fe4N1-x
TL;DR: In this article, the authors showed that a specific choice of a first and a subsequent nitriding treatment controlled development of residual stress profiles is possible in thin iron-nitride surface layers.
Journal ArticleDOI
Stress-induced deformation of the coating on large lightweight freeform optics.
Guanbo Qiao,Haixiang Hu,Xuejun Zhang,Xiao Luo,Donglin Xue,Ge Zhang,Haifei Hu,Liqi Yi,Yu Yang,Weijie Deng +9 more
TL;DR: In this article, a finite element model (FEM) and a ray tracing model were constructed to estimate the impact of the stress-induced deformation of the coating on a 1.5m class lightweight silicon carbine (SiC) mirror with a freeform surface.
Book ChapterDOI
Chapter 11 – Film Characterization and Some Basic Film Properties
TL;DR: In this article, the authors provide an introduction to film characterization and discuss some basic film properties such as elemental composition, chemical state, residual stress, electrical properties, optical properties, and chemical properties.
Journal ArticleDOI
Plasma-Enhanced Atomic Layer Deposition of HfO2 with Substrate Biasing: Thin Films for High-Reflective Mirrors.
Vivek Beladiya,Tahsin Faraz,Paul Guillaume Schmitt,Anne-Sophie Munser,Sven Schröder,S. Riese,Christian Mühlig,Daniel Schachtler,Fabian Steger,Roelene Botha,Felix Otto,Torsten Fritz,Christian van Helvoirt,Wmm Erwin Kessels,Hassan Gargouri,Adriana Szeghalmi +15 more
TL;DR: In this article , the influence of the bias value on the properties of HfO2 thin films was analyzed using tetrakis(dimethylamino)cyclopentadienyl hafnium (TDMAH) and oxygen plasma.
Journal ArticleDOI
The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS
TL;DR: In this paper, the effect of residual stress during the tungsten deposition process was investigated using metaloxide-nitride-oxide-semiconductor (MONOS) devices, and the absolute value of stress significantly affected these issues regardless of the polarity.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.