Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
TL;DR: High power pulsed magnetron sputtering (HPPMS) is an emerging technology that has gained substantial interest among academics and industrials alike as discussed by the authors, also known as HIPIMS (high power impulse...
Book
Handbook of physical vapor deposition (PVD) processing
TL;DR: Physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing is discussed in this paper.
Journal ArticleDOI
Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
William D. Nix,Bruce M. Clemens +1 more
TL;DR: In this paper, the authors examined the stress associated with crystallite coalescence during the initial stages of growth in thin polycrystalline films with island growth morphology and predicted large tensile stresses in agreement with experimental results.
Journal ArticleDOI
Review of advances in cubic boron nitride film synthesis
TL;DR: A review of recent developments in BN film synthesis and characterization can be found in this paper, where the key experimental parameters controlling cBN film formation and synthesis techniques are discussed and the proposed mechanisms of cBN formation and the observed mechanical and electrical properties of CBN films are analyzed.
Journal ArticleDOI
Design and evaluation of tribological coatings
TL;DR: The use of coatings to improve the tribological properties of components such as tools for metal cutting and forming, and machine elements e.g. sliding bearings, seals and valves is constantly increasing.
References
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Journal ArticleDOI
Glow discharge sputtering
TL;DR: In this article, the authors describe the arrival at the substrate of a thin film and its formation and growth, including simple interfacial adhesion, interdiffusion between two materials, formation of intermediate layers and mechanical adhesion.
Journal ArticleDOI
A sputtering wind
TL;DR: In this article, a directional pressure probe extending from a capacitance manometer and rotatable over 360 degrees of orientation was inserted at midlength near a high-rate magnetron sputtering source.
Journal ArticleDOI
Effects of humidity on stress in thin silicon dioxide films
TL;DR: In this article, the stresses of thermally grown and chemically vapor deposited (CVD) silicon dioxide were measured by the cantilever beam technique using x-ray diffraction, and it was concluded that their average linear thermal expansion coefficient in the temperature range of −170-115 C is 4×10−6 °C−1, while their biaxial elastic modulus is only 4.6-5.1×1011 dyn/cm2.
Journal ArticleDOI
Role of incident kinetic energy of adatoms in thin film growth
TL;DR: In this article, film growth as a function of incident kinetic energy of adatoms is studied by employing two-dimensional molecular dynamics simulations for Lennard-Jones particles, showing that at thermal incident kinetic energies films exhibit a high void and defect content when grown on a zero temperature substrate.