Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
More filters
Proceedings ArticleDOI
Nanoelectromechanical infrared detector
TL;DR: In this paper, an uncooled infrared detector based on a 1 mm×1 mm large nanoelectromechanical drum resonator made of 50 nm thick low-stress silicon nitride (SiN) is presented.
Journal ArticleDOI
In Situ and Real-Time Nanoscale Monitoring of Ultra-Thin Metal Film Growth Using Optical and Electrical Diagnostic Tools.
J. Colin,Andreas Jamnig,Clarisse Furgeaud,A. Michel,N. Pliatsikas,Kostas Sarakinos,Gregory Abadias +6 more
TL;DR: Wafer curvature, spectroscopic ellipsometry, and resistivity techniques are shown to be complementary in studying the morphological evolution of discontinuous layers, and determining the percolation threshold and the onset of continuous film formation.
Journal ArticleDOI
Unravelling the ion-energy-dependent structure evolution and its implications for the elastic properties of (V,Al)N thin films
Soheil Karimi Aghda,Denis Music,Yeliz Unutulmazsoy,Heng Han Sua,Stanislav Mráz,Marcus Hans,Daniel Primetzhofer,André Anders,André Anders,Jochen M. Schneider +9 more
TL;DR: Ion irradiation-induced changes in the structure and mechanical properties of metastable cubic (V,Al)N deposited by reactive high power pulsed magnetron sputtering are systematically investigated by correlating experiments and theory in the ion kinetic energy (E k ) range from 4 to 154 eV.
Journal ArticleDOI
Control of stress in protected silver mirrors prepared by plasma beam sputtering
TL;DR: The durability of the mirrors was strongly dependent upon the presence of a very thin chromium adhesion layer between the silver layer and the dielectric overcoat.
Journal ArticleDOI
In situ stress measurements in zirconium and zirconium oxide films prepared by direct current sputtering
R. Drese,Matthias Wuttig +1 more
TL;DR: In this paper, the evolution of stress during growth of thin zirconium and ZIRconium oxide films deposited from a metallic target using direct current magnetron sputtering has been analyzed in situ.
References
More filters
Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.