Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
Effect of oxygen addition on microstructure and mechanical properties of quaternary TNTZ superelastic thin films obtained by magnetron sputtering
Sofiane Achache,Akram Alhussein,Bruno Guelorget,Roland Salut,Manuel François,Frédéric Sanchette +5 more
TL;DR: In this article, the influence of oxygen addition on the superelasticity and mechanical performance of Ti-23Nb-0.7Ta-2Zr (TNTZ-(O), at.
Journal ArticleDOI
Correlation between growth stress and microstructure in CoCrPt alloy thin film with nanogranular structure
TL;DR: In this paper, the authors investigated in situ stress evolution for (Co82Cr18)87Pt13 /Ti alloy film in an ultrahigh vacuum (UHV) chamber equipped with a highly sensitive optical deflection-detecting system.
Journal ArticleDOI
Thermal expansion of Ni/Cu multilayers
TL;DR: In this article, the authors measured the thermal expansion coefficient of electrodeposited Ni/Cu multilayers by measuring the evolution of membrane resonances and hence the tension as a function of temperature.
DissertationDOI
Die elektrischen Eigenschaften von Indiumoxid-Dünnschichten: in-situ Hall-Effekt-Messungen zur Aufklärung des Einflusses von Punktdefekten und Korngrenzen
TL;DR: Moglich et al. as discussed by the authors showed that the Ladungstragerbeweglichkeit is not konstant, sondern stark von der Ladung-strager-konzentration abhangt, in a polykristalline Indiumoxid-Dunnschichten.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.