Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
TL;DR: High power pulsed magnetron sputtering (HPPMS) is an emerging technology that has gained substantial interest among academics and industrials alike as discussed by the authors, also known as HIPIMS (high power impulse...
Book
Handbook of physical vapor deposition (PVD) processing
TL;DR: Physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing is discussed in this paper.
Journal ArticleDOI
Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
William D. Nix,Bruce M. Clemens +1 more
TL;DR: In this paper, the authors examined the stress associated with crystallite coalescence during the initial stages of growth in thin polycrystalline films with island growth morphology and predicted large tensile stresses in agreement with experimental results.
Journal ArticleDOI
Review of advances in cubic boron nitride film synthesis
TL;DR: A review of recent developments in BN film synthesis and characterization can be found in this paper, where the key experimental parameters controlling cBN film formation and synthesis techniques are discussed and the proposed mechanisms of cBN formation and the observed mechanical and electrical properties of CBN films are analyzed.
Journal ArticleDOI
Design and evaluation of tribological coatings
TL;DR: The use of coatings to improve the tribological properties of components such as tools for metal cutting and forming, and machine elements e.g. sliding bearings, seals and valves is constantly increasing.
References
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Journal ArticleDOI
Effect of ion bombardment during deposition on thick metal and ceramic deposits
TL;DR: In this paper, the effect of ion bombardment on the morphology, structure, stochiometry, and physical properties of a sputter-deposited glass film has been investigated and it was found that ion bombardment affects the stoichiometry, the coefficient of thermal expansion, and the strain point of the glass.
Journal ArticleDOI
The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressures☆
D.W. Hoffman,John A. Thornton +1 more
TL;DR: In this article, Hoffman et al. investigated the internal stresses in thin sputtered films of Al, V, Zr, Nb and W and found that the electrical conductivity and optical reflectance of the sputtered metal films exhibit abrupt changes in behavior near the transition pressure for compressive stresses.
Journal ArticleDOI
Simulation of structural anisotropy and void formation in amorphous thin films
TL;DR: In this paper, the authors simulated the structure of thin amorphous films grown from a vapor and showed that structural anisotropy and voids are a natural occurrence of the deposition process.
Journal ArticleDOI
Approximations and interpolation rules for ranges and range stragglings
TL;DR: In this paper, an interpolation rule for ranges and stragglings in amorphous substances is presented. But the agreement of the results with accurate range-calculations is better than ∼10 per cent.
Journal ArticleDOI
Stress, strain, and microstructure of sputter‐deposited Mo thin films
TL;DR: In this article, a tensile tensile lattice strain analysis was performed by using cross-sectional transmission electron microscopy (TEM) for a planar magnetron sputtering application on glass substrates.