Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
Reduction of residual stress in AlN thin films synthesized by magnetron sputtering technique
Padmalochan Panda,R. Ramaseshan,N. Ravi,G. Mangamma,Feby Jose,Sitaram Dash,K. Suzuki,Hisayuki Suematsu +7 more
TL;DR: In this article, the reduction in residual stress, the crystal structure, surface morphology and nano-mechanical properties of magnetron sputtered AlN thin films as a function of substrate temperature (T s, 35-600 ǫ ) were reported.
Journal ArticleDOI
Combined transmission electron microscopy and x‐ray study of the microstructure and texture in sputtered Mo films
TL;DR: In this article, the microstructure and texture of thin Mo films sputtered onto the native oxide of Si(100) wafers were investigated with both conventional reflection x-ray pole figures, and transmission electron microscopy and diffraction.
Journal ArticleDOI
Internal interfaces and intrinsic stress in thin amorphous Cu-Ti and Co-Tb films
U. Geyer,U. von Hülsen,H. Kopf +2 more
TL;DR: In this article, a combined investigation of intrinsic tensile stress and surface morphology evolution by scanning tunneling microscopy during the growth of amorphous Cu-Ti and Co-Tb films is reported.
Journal ArticleDOI
Direct measurement of residual stress in sub-micron interconnects
Alton B. Horsfall,J.M.M. dos Santos,S.M. Soare,Nicholas G. Wright,Anthony O'Neill,Steve Bull,Anthony J. Walton,Alan M. Gundlach,J.T.M. Stevenson +8 more
TL;DR: In this article, a rotating beam sensor is used to measure process-induced stress in a single interconnect structure, fabricated in a CMOS compatible process, using a rotating-beam sensor.
Patent
Method for alkali doping of thin film photovoltaic materials
TL;DR: In this paper, a method of manufacturing a solar cell includes providing a substrate, depositing a first electrode comprising an alkali-containing transition metal layer over the substrate, and depositing at least one p-type semiconductor absorber layer on the first electrode.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.