Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Interface Optimization of Tungsten Fiber-Reinforced Copper for Heat Sink Application
TL;DR: In this paper, an advanced Wf/Cu metal-matrix composite (MMC) was proposed as an efficient high temperature heat sink material for future fusion reactors like DEMO. The main focus is the interface optimization between the W fibers and the Cu matrix of the MMC for enhanced adhesion, resulting in good mechanical properties of the compound.
Journal ArticleDOI
Stresses in Ru/PbZr 0.4 Ti 0.6 O 3 /Ru thin film stacks for integrated ferroelectric capacitors
TL;DR: In this paper, it was observed that an annealing treatment of the Ru/PbZr 0.4 Ti 0.6 O 3 /Ru stack influences the stress in the PbZR 0.5 O 3 film.
Journal ArticleDOI
Role of ion beam assisted deposition in the synthesis and fracture of metal-ceramic multilayers
TL;DR: In this paper, a single trilayer and five-bilayer metal-ceramic, Al-Al 2 O 3 films were fabricated on ductile metal substrates using IBAD over a range of thicknesses and normalized energies.
Dissertation
Tailoring Structural and Energy-related Properties of Thin Films Using HiPIMS
TL;DR: In this paper, the most important parameters affecting the film structure and properties are the amount as well as the kinetic energy of the ionized sputtered species irradiating the film during growth.
Journal ArticleDOI
Structural and mechanical analysis for the optimization of PVD oxide coatings for protection against metal dusting
L.M. López,O. Salas,L. Melo-Máximo,J. Oseguera,Carlos Maurício Lepienski,Paulo Soares,Ricardo D. Torres,Roberto Molina de Souza +7 more
TL;DR: In this article, the evolution of the structure and properties of Cr/Cr oxide thin films deposited on HK40 steel substrates by reactive magnetron sputtering (RMS) was investigated and linked to their potential protective behavior against metal dusting.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.