Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Crystallographic texture in cubic boron nitride thin films
TL;DR: In this article, the authors examined the crystallographic texture exhibited by cubic boron nitride (cBN) in thin films grown by ion-assisted deposition and found that the cBN is preferentially oriented such that individual crystallites have at least one [111] direction lying in the plane of the film but are otherwise randomly oriented about (1) the substrate normal and (2) the in-plane cBN [ 111] axis.
Journal ArticleDOI
Internal stress and surface morphology of zinc oxide thin films deposited by filtered cathodic vacuum arc technique
TL;DR: In this article, a radius of curvature technique was used to study stresses in zinc oxide (ZnO) films prepared by filtered cathodic vacuum arc and O 2 was fed into the chamber.
Journal ArticleDOI
Impact of Film Thickness on Defects and the Graphitization of Nanothin Carbon Coatings Used for Metallic Bipolar Plates in Proton Exchange Membrane Fuel Cells
TL;DR: Corrosion and interfacial contact resistance (ICR) test results show that an approximately 69 nm a-C layer, with a deposition time of only 15 min, can meet ex situ technical targets of US Department of Energy.
Journal ArticleDOI
Stress evolution in magnetron sputtered Ti–Zr–N and Ti–Ta–N films studied by in situ wafer curvature: Role of energetic particles
TL;DR: In this paper, the authors studied the stress evolution during reactive magnetron sputtering of binary TiN, ZrN and TaN thin films as well as ternary Ti-Zr-N and Ti-Ta-N solid solutions using real-time wafer curvature measurements.
Journal ArticleDOI
Hard graphitic-like amorphous carbon films with high stress and local microscopic density
TL;DR: In this article, the authors report unusual properties of amorphous carbon films prepared by ion beam-assisted deposition using different noble gases (neon, argon, and krypton).
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
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Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.