Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
Structural, optical and mechanical properties of coloured TiNxOy thin films
Filipe Vaz,P. Cerqueira,L. Rebouta,Sérgio M. C. Nascimento,Eduardo Alves,Ph. Goudeau,J.P. Rivière,K. Pischow,J de Rijk +8 more
TL;DR: In this paper, coloured films based on single layered titanium oxynitride (TiN x O y ) compounds were prepared by r.f. magnetron sputtering under variation of process parameters such as bias voltage and flow rate of reactive gases.
Journal ArticleDOI
Ion induced stress generation in arc‐evaporated TiN films
TL;DR: In this article, the influence of Ti ion bombardment on the intrinsic stress and microstructure of TiN films during deposition by arc evaporation of Ti in pure N2 has been investigated.
Journal ArticleDOI
Electronic Devices Using Open Framework Materials.
TL;DR: It is concluded that OFM constitute a unique class of electronic materials with characteristics and advantages that are distinct from either conventional inorganic semiconductors or organic conductors, and suggests a bright future for these materials in applications such as edge computing, resistive switching, and mechanically flexible sensing and electronics.
Journal ArticleDOI
Generation and evolution of residual stresses in physical vapour-deposited thin films
TL;DR: In this paper, the authors investigated the role of thermal, intrinsic and extrinsic stresses in the formation of physical vapour deposition (PVD) films and found that tensile intrinsic stresses are usually observed in not fully dense films deposited by thermal evaporation from non-energetic particles.
Journal ArticleDOI
Hard x-ray nanofocusing by multilayer Laue lenses
TL;DR: A comprehensive review of advances in multilayer Laue lens (MLL) is provided in this paper, which includes extensive theoretical modelling on focusing performance, discussion on fabrication challenges, their current capabilities and notable results from x-ray focusing experiments.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
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Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
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Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.