Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
Stress Evolution Kinetics in Ultra Thin Sputtered Au Films
TL;DR: In this paper, the authors studied the stress and microstructure of a thin film and found that the intrinsic stress of the depositing layer increases with the coverage of the film on the substrate and that the average stress reaches a sharp maximum as the film become continuous.
Proceedings ArticleDOI
Internal stress in sputtered gold electrodes and its significance for quartz resonators
TL;DR: In this article, internal stress in magnetron sputtered gold films, as estimated with the cantilever beam deflection method, is correlated to deposition parameters such as pressure, temperature and deposition rate, as well as morphology and the amount of gas entrapped in the film.
Journal ArticleDOI
Stress-field in Sputtered Mo Thin Films and Mo/Ni Superlattices: Origin and Evolution after Ion-Irradiation
TL;DR: In this paper, the ion irradiation technique is used to investigate the origin of the stress-field in Mo layers grown by ion beam sputtering, and a new stress model based on a triaxial state of stress, which includes a hydrostatic component linked to point defects induced volume distortions, is derived to interpret the X-ray Diffraction (XRD) results.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.