Journal ArticleDOI
Intrinsic stress in sputter-deposited thin films
TLDR
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process as discussed by the authors, and extensive experimental evidence show a direct link between the particle flux and energy striking the condensing film, which determines the nature and magnitude of the stress.Abstract:
A review of the sputtered film stress literature shows that the intrinsic stress can be tensile or compressive depending on the energetics of the deposition process. Modeling studies of film growth and extensive experimental evidence show a direct link between the energetics of the deposition process and film microstructure, which in turn determines the nature and magnitude of the stress. The fundamental quantities are the particle flux and energy striking the condensing film, which are a function of many process parameters such as pressure (discharge voltage), target/sputtering gas mass ratio, cathode shape, bias voltage, and substrate orientation. Tensile stress is generally observed in zone 1-type, porous films and is explained in terms of the grain boundary relaxation model, whereas compressive stress, observed in zone T-type, dense films, is interpreted in terms of the atomic peening mechanism. Modeling of the atomic peening mechanism and experimental data indicate that the normalized moment...read more
Citations
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Journal ArticleDOI
A Critical Review on Nickel–Titanium Thin-Film Shape Memory Alloy Fabricated by Magnetron Sputtering and Influence of Process Parameters
TL;DR: In this paper, the NiTi phase diagram along with the shape memory effect and superelasticity has also been explained and the utilization of shape memory behavior in various industrial applications has been discussed here, also the advantages and limitations of SMA have been briefly discussed.
Journal ArticleDOI
Structure, stress and optical properties of Cr/C multilayers for the tender X-ray range.
TL;DR: It has been determined that a Cr thickness ratio value of 0.37 is the best choice for a Cr/C multilayer in view of high reflectivity and low stress.
Journal ArticleDOI
Tilted fluctuation electron microscopy
Ellis Kennedy,Neal Reynolds,Neal Reynolds,Luis Rangel DaCosta,Frances Hellman,Frances Hellman,Colin Ophus,Mary Scott,Mary Scott +8 more
TL;DR: In this article, the authors applied FEM to characterize the strain and MRO of magnetron sputtered amorphous tantalum (a-Ta) thin films over a range of tilt angles from 0 ° to 45 ° in order to measure any deviations between the in-plane and out-of-plane strain and the MRO.
Journal ArticleDOI
Deposition Kinetics and Microstructural Evolution in Sputtered TA Films: a Real-Time/In-Situ Study
TL;DR: In this paper, Ta films were grown using sputter gas (Ar) pressures ranging from 1.7 to 20 mTorr, which produced growth environments where incoming adatom kinetic energies ranged from over 100 eV to less than 1 eV.
Journal ArticleDOI
Residual stress and microstructural evolution in thin film materials for a micro solid oxide fuel cell (SOFC).
TL;DR: In this paper, the authors explore residual stress in sputter-deposited yttria stabilized zirconia (YSZ) thin films (5nm-1000nm thickness) as a function of deposition pressure and substrate temperature.
References
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Journal ArticleDOI
Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets
TL;DR: In this article, an integrodifferential equation for the sputtering yield is developed from the general Boltzmann transport equation, and solutions of the integral equation are given that are asymptotically exact in the limit of high ion energy as compared to atomic binding energies.
Journal ArticleDOI
Mechanical properties of thin films
TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Journal ArticleDOI
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
TL;DR: Two cylindrically symmetric and complementary sputtering geometries, the post and hollow cathodes, were used to deposit thick coatings of various metals (Mo, Cr, Ti, Fe, Cu, and Al-alloy) onto glass and metallic substrates at deposition rates of 1000-2000 A/min under various conditions of substrate temperature, argon pressure, and plasma bombardment as mentioned in this paper.
Journal ArticleDOI
High Rate Thick Film Growth
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.