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Low-threshold optically pumped lasing in highly strained germanium nanowires.

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TLDR
A low-threshold, compact group IV laser is demonstrated that employs a germanium nanowire under a 1.6% uniaxial tensile strain as the gain medium, allowing the observation of multimode lasing with an optical pumping threshold density of ~3.0 kW cm−2.
Abstract
The integration of efficient, miniaturized group IV lasers into CMOS architecture holds the key to the realization of fully functional photonic-integrated circuits. Despite several years of progress, however, all group IV lasers reported to date exhibit impractically high thresholds owing to their unfavourable bandstructures. Highly strained germanium with its fundamentally altered bandstructure has emerged as a potential low-threshold gain medium, but there has yet to be a successful demonstration of lasing from this seemingly promising material system. Here we demonstrate a low-threshold, compact group IV laser that employs a germanium nanowire under a 1.6% uniaxial tensile strain as the gain medium. The amplified material gain in strained germanium can sufficiently overcome optical losses at 83 K, thus allowing the observation of multimode lasing with an optical pumping threshold density of ~3.0 kW cm−2. Our demonstration opens new possibilities for group IV lasers for photonic-integrated circuits. Integrating group IV lasing devices into technologically relevant CMOS architectures has proven challenging. Here, the authors demonstrate low-threshold lasing, which is important for potential electronic and photonic circuits, using strained germanium nanowires as the gain material.

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Nanowire Electronics: From Nanoscale to Macroscale

TL;DR: A comprehensive review of the continuing efforts in exploring semiconductor nanowires for the assembly of functional nanoscale electronics and macroelectronics, including a unique design of solution-processable nanowire thin-film transistors for high-performance large-area flexible electronics.
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Strain engineering of 2D semiconductors and graphene: from strain fields to band-structure tuning and photonic applications.

TL;DR: This review begins with an introduction to the macroscopic theory of crystal elasticity and microscopic effective low-energy Hamiltonians coupled with strain fields, and summarizes recent advances in strain-induced optical responses of 2D TMDCs and graphene, followed by the strain engineering techniques.
Journal ArticleDOI

Germanium-based integrated photonics from near- to mid-infrared applications

TL;DR: Germanium has played a key role in silicon photonics as an enabling material for datacom applications as discussed by the authors, and the unique properties of Ge have been leveraged to develop high performance integrated photodectors, which are now mature devices.
Journal ArticleDOI

Ultra-low threshold cw and pulsed lasing in tensile strained GeSn alloys

TL;DR: In this article, a 300nm GeSn layer with 5.4 at.% Sn, which is an indirect band-gap semiconductor as-grown with a compressive strain of -0.32 %, is transformed via tensile strain engineering into a truly direct band gap semiconductor.
References
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Journal ArticleDOI

Device Requirements for Optical Interconnects to Silicon Chips

TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
Journal ArticleDOI

The Past, Present, and Future of Silicon Photonics

TL;DR: In this paper, the state-of-the-art CMOS silicon-on-insulator (SOI) foundries are now being utilized in a crucial test of 1.55mum monolithic optoelectronic (OE) integration, a test sponsored by the Defense Advanced Research Projects Agency (DARPA).
Journal ArticleDOI

Mid-infrared photonics in silicon and germanium

TL;DR: In this article, the authors proposed a method to extend group IV photonics from near-infrared to midinfrared wavelengths using on-chip CMOS optoelectronic systems for use in spectroscopy, chemical and biological sensing, and free space communications.
Journal ArticleDOI

Large-scale nanophotonic phased array

TL;DR: This work demonstrates that a robust design, together with state-of-the-art complementary metal-oxide–semiconductor technology, allows large-scale NPAs to be implemented on compact and inexpensive nanophotonic chips and therefore extends the functionalities of phased arrays beyond conventional beam focusing and steering, opening up possibilities for large- scale deployment.
Journal ArticleDOI

Lasing in direct-bandgap GeSn alloy grown on Si

TL;DR: In this paper, a direct bandgap GeSn alloy, grown directly onto Si(001), was used for experimentally demonstrating lasing threshold and linewidth narrowing at low temperatures.
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