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Journal ArticleDOI

Positive Threshold Voltage Shift in AlGaN/GaN HEMTs and E-Mode Operation By ${\mathrm{Al}}_{x}{\mathrm{Ti}}_{1-x}$ O Based Gate Stack Engineering

TLDR
In this article, the authors have experimentally demonstrated enhancement mode (e-mode) AlGaN/GaN high-electron-mobility transistor (HEMT) operation by integrating p-type high-kappa Ω(kappa ) based gate stack.
Abstract
In this paper, for the first time, we have experimentally demonstrated enhancement mode (e-mode) AlGaN/GaN high-electron-mobility transistor (HEMT) operation by integrating p-type high- $\kappa {\mathrm {Al}}_{x}{\mathrm {Ti}}_{1-x}$ O based gate stack. Concentration of Al in Al-Ti-O system was found to be a tuning parameter for the threshold voltage of GaN HEMTs. The high- $\kappa $ properties of ${\mathrm {Al}}_{x}{\mathrm {Ti}}_{1-x}$ O as a function of Al % are studied. Superiority of AlTiO over other p-oxides such as CuO and NiO x is proven statistically. Using the high- $\kappa $ and p-type AlTiO, in conjunction with a thinner AlGaN barrier under gate, 600-V e-mode GaN HEMTs are demonstrated with superior ON-state performance ( $\text{I}_{ \mathrm{\scriptscriptstyle ON}}~\sim ~400$ mA/mm and $\text{R}_{ \mathrm{\scriptscriptstyle ON}} ={8.9}\,\,\Omega $ -mm) and gate control over channel ( $\text{I}_{ \mathrm{\scriptscriptstyle ON}}/\text{I}_{ \mathrm{\scriptscriptstyle OFF}} = {10}^{{7}}$ , SS = 73 mV/dec, and gate leakage <200 nA/mm), beside improved safe operating area reliability.

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Citations
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Journal ArticleDOI

Improving Performances of Enhancement-Mode AlGaN/GaN MIS-HEMTs on 6-inch Si Substrate Utilizing SiON/Al 2 O 3 Stack Dielectrics

TL;DR: In this paper, a gate scheme featuring SiON/Al2O3 stack dielectrics and partially recessed gate barrier has been employed in the AlGaN/GaN MIS-HEMTs.
Journal ArticleDOI

Design principle for a p-type oxide gate layer on AlGaN/GaN toward normally-off HEMTs: Li-doped NiO as a model

TL;DR: In this article, Li-doped NiO thin films with various doping contents were grown on GaN/GaN/Si substrates by pulsed laser deposition (PLD) to identify the most important physical properties and design principle of p-type oxide for normally off HEMTs.
Journal ArticleDOI

Current efforts on sustainable green growth in the manufacturing sector to complement "make in India" for making "self-reliant India".

TL;DR: In an effort to become a global manufacturing giant, India has launched an ambitious "Make in India" campaign as mentioned in this paper, which aims to improve the manufacturing output of India and reduce dependence on foreign imports for which campaigns like "Atmanirbhar Bharat" which translates into "Self-Reliant-Green" India has also been started.
Journal ArticleDOI

Current efforts on sustainable green growth in the manufacturing sector to complement “make in India” for making “self-reliant India”

TL;DR: In an effort to become a global manufacturing giant, India has launched an ambitious "Make in India" campaign as mentioned in this paper , which aims to improve the manufacturing output of India and reduce dependence on foreign imports for which campaigns like Atmanirbhar Bharat which translates into "Self-Reliant-Green" India has also been started.
Journal ArticleDOI

Interplay Between Surface and Buffer Traps in Governing Breakdown Characteristics of AlGaN/GaN HEMTs—Part II

TL;DR: In this paper, physical insights into the complex interplay of surface and buffer traps governing breakdown characteristics of AlGaN/GaN HEMTs are developed by well-calibrated TCAD simulations.
References
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Book ChapterDOI

Relations between the Concentrations of Imperfections in Crystalline Solids

TL;DR: In this paper, a study on relations between the concentrations of imperfections in crystalline solids is presented, and a new treatment of these problems by making use of a graphical representation is presented.
Journal ArticleDOI

p-GaN Gate HEMTs With Tungsten Gate Metal for High Threshold Voltage and Low Gate Current

TL;DR: In this paper, the impact of gate metals on the threshold voltage and the gate current of p-GaN gate high-electron-mobility transistors (HEMTs) is investigated.
Journal ArticleDOI

600-V Normally Off ${\rm SiN}_{x}$ /AlGaN/GaN MIS-HEMT With Large Gate Swing and Low Current Collapse

TL;DR: In this paper, a 600-V normally-off SiNx/AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) is reported.
Journal ArticleDOI

Forward Bias Gate Breakdown Mechanism in Enhancement-Mode p-GaN Gate AlGaN/GaN High-Electron Mobility Transistors

TL;DR: In this paper, the temperature dependence of the forward bias gate breakdown has been characterized for enhancement-mode p-GaN gate AlGaN/GaN high-electron mobility transistors.
Proceedings ArticleDOI

Integration of LPCVD-SiN x gate dielectric with recessed-gate E-mode GaN MIS-FETs: Toward high performance, high stability and long TDDB lifetime

TL;DR: By employing an interface protection technique to overcome the degradation of etched GaN surface in high-temperature process, highly reliable LPCVD-SiN x gate dielectric was successfully integrated with recessed-gate structure to achieve high performance enhancement mode (V th ∼ + 2.37 V @ I d = 100 μA/mm) GaN MIS-FETs with high stability and high reliability.
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