Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
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Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics
TL;DR: In this paper , a dielectric fluid cooling concept for automotive power electronics is described, which combines a lowthermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces).
Journal ArticleDOI
A Vertically Enhanced Manifold Microchannel System for Thermal Management of Power Electronics
TL;DR: In this article, a vertically enhanced manifold microchannel system (VEMMS) is proposed for thermal management of high-power switches in a dual active bridge converter, where a flat heat sink is used to shrink in footprint but expands away from the board in the direction of its height, for increased heat transfer area while keeping the footprint on the printed circuit board (PCB).
Journal ArticleDOI
Vapor stem bubbles dominate heat transfer enhancement in extremely confined boiling
TL;DR: In this paper, the authors investigated the thermofluidic transport mechanisms of boiling in extremely confined gaps through experimental measure of the temporal evolution of heat fluxes and surface temperatures during deionized water boiling, as well as high-speed visualization of bubble formation.
Journal ArticleDOI
A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging
Wenwu Zhang,Penghao Zhang,Da Wei Lu,Hao Pan,Xiang Liu,Cheng-Yan Xu,Jun Wei,Mingyu Li,Hongjun Ji +8 more
TL;DR: In this article , a supersaturated Ag-Cu bimetallic nanoalloy joint with ultrahigh shear strength (152 MPa) was achieved, and the interstitial solid solutions with atomic-level metallurgical bonds at the interface dominantly promoted the Shear strength.
Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics
TL;DR: In this article , the authors describe the design and performance of a dielectric fluid cooling concept for automotive power electronics, which combines a low-thermal-resistance package with a high-performance convective cooling strategy (slot jets impinging on finned surfaces).
References
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High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
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A Survey of Wide Bandgap Power Semiconductor Devices
TL;DR: In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
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Graphite Nanoplatelet−Epoxy Composite Thermal Interface Materials
TL;DR: In this article, the performance of a few graphene layer n ∼ 4, with a thickness of ∼ 2 nm, was investigated for epoxy composites and it was shown that the G4 GNPs provide a thermal conductivity enhancement of more than 3000% (loading of ∼25 vol %).
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Fundamental issues related to flow boiling in minichannels and microchannels
TL;DR: In this article, the effects of the channel size on the flow patterns and heat transfer and pressure drop performance are reviewed in small hydraulic diameter channels, and the fundamental questions related to the presence of nucleate boiling and characteristics of flow boiling in microchannels and minichannels in comparison to that in the conventional channel sizes (3 mm and above) are addressed.
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Assessment of high-heat-flux thermal management schemes
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.