Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
Citations
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Journal ArticleDOI
Automotive Traction Inverters: Current Status and Future Trends
TL;DR: An independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers is presented, highlighting wide bandgap devices and trends in device packaging.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Journal ArticleDOI
Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles
Iqbal Husain,Burak Ozpineci,Sariful Islam,Emre Gurpinar,Gui-Jia Su,Wensong Yu,Shajjad Chowdhury,Lincoln Xue,Dhrubo Rahman,Raj Sahu +9 more
TL;DR: The electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance are discussed.
Journal ArticleDOI
Automotive Power Module Packaging: Current Status and Future Trends
TL;DR: This paper presents a comprehensive review of the automotive power module packaging technologies and concludes that a preferable overall performance could be achieved by combining multiple technologies.
Journal ArticleDOI
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
References
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Journal ArticleDOI
Wide-Bandgap-Based Power Devices: Reshaping the power electronics landscape
TL;DR: In this paper, a widebandgap (WBG)-based power device is proposed to replace the maturing silicon (Si) with more robust emerging technologies, such as GaN and silicon carbide (SiC).
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Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material
TL;DR: In this article, an epoxy matrix composite adhesive containing aluminum nitride (AlN) powder was used for thermal interface materials (TIM) in high power devices, and the experimental results revealed that adding AlN fillers into epoxy resin was an effective way to boost thermal conductivity and maintain electrical insulation.
Journal ArticleDOI
On further enhancement of single-phase and flow boiling heat transfer in micro/minichannels
Zan Wu,Bengt Sundén +1 more
TL;DR: In this paper, the authors presented the classification of micro/minichannels for single-phase flow and flow boiling and gave a general statement of heat transfer enhancement, and provided a state-of-the-art overview of the most recent enhancement techniques.
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Silver nanowire array-polymer composite as thermal interface material
TL;DR: In this article, the authors used a contact impedance model to compare the contact impedance of aligned silver nanowire-polymer composites with that of aligned carbon nanotubes, which showed that the Young's modulus of the composite is the defining factor in the overall thermal impedance of these composites.
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GaN Substrates—Progress, Status, and Prospects
Tanja Paskova,Keith R. Evans +1 more
TL;DR: In this article, progress in the primary competing growth techniques for producing native GaN substrates is reviewed and the technological issues pertaining to faster scalability of GaN substrate production are discussed.