Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
Citations
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Journal ArticleDOI
Automotive Traction Inverters: Current Status and Future Trends
TL;DR: An independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers is presented, highlighting wide bandgap devices and trends in device packaging.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Journal ArticleDOI
Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles
Iqbal Husain,Burak Ozpineci,Sariful Islam,Emre Gurpinar,Gui-Jia Su,Wensong Yu,Shajjad Chowdhury,Lincoln Xue,Dhrubo Rahman,Raj Sahu +9 more
TL;DR: The electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance are discussed.
Journal ArticleDOI
Automotive Power Module Packaging: Current Status and Future Trends
TL;DR: This paper presents a comprehensive review of the automotive power module packaging technologies and concludes that a preferable overall performance could be achieved by combining multiple technologies.
Journal ArticleDOI
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
References
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Proceedings ArticleDOI
Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
TL;DR: In this paper, the authors presented a recently fabricated embedded cooling system consisting of a state-of-the-art 3D microfluidic manifold suitable for near term integration into existing systems.
Journal ArticleDOI
Embedded Two-Phase Cooling of High Flux Electronics via Press-Fit and Bonded FEEDS Coolers
Journal ArticleDOI
Development of Power Control Unit for Compact-Class Vehicle
Proceedings ArticleDOI
Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler
Daniel G. Bae,Raphael Mandel,Serguei Dessiatoun,Srihari Rajgopal,Samantha P. Roberts,Mehran Mehregany,Michael M. Ohadi +6 more
TL;DR: In this paper, a two-phase, embedded cooling system for high heat flux electronics on silicon carbide (SiC) substrates is presented, which uses a thin-film Evaporation and Enhanced fluid Delivery System (FEEDS) Manifold-Microchannel (MMC) cooler.
Proceedings ArticleDOI
Development of a power dense and environmentally robust traction power inverter for the second-generatio chevrolet VOLT extended-range EV
TL;DR: In this paper, GM and Delphi reduced the physical size and mass of the traction power inverter module (TPIM) for 2nd generation Chevrolet VOLT Extended-Range EV.