Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
Citations
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Journal ArticleDOI
Automotive Traction Inverters: Current Status and Future Trends
TL;DR: An independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers is presented, highlighting wide bandgap devices and trends in device packaging.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Journal ArticleDOI
Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles
Iqbal Husain,Burak Ozpineci,Sariful Islam,Emre Gurpinar,Gui-Jia Su,Wensong Yu,Shajjad Chowdhury,Lincoln Xue,Dhrubo Rahman,Raj Sahu +9 more
TL;DR: The electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance are discussed.
Journal ArticleDOI
Automotive Power Module Packaging: Current Status and Future Trends
TL;DR: This paper presents a comprehensive review of the automotive power module packaging technologies and concludes that a preferable overall performance could be achieved by combining multiple technologies.
Journal ArticleDOI
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
References
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Proceedings ArticleDOI
Compact and high power inverter for the Cadillac CT6 rear wheel drive PHEV
TL;DR: In this article, the authors describe indispensable and collaborative design efforts by Hitachi Automotive and General Motors to meet the challenge of enhancing heat dissipation performance and using high efficient power semiconductor enables reduced inverter size and increased power output.
Journal ArticleDOI
Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization
TL;DR: In this article, an extensive experimental study was conducted to investigate the base temperature response of multi-microchannel evaporators under transient heat loads, including cold startups and periodic step variations in heat flux using two different test sections and two coolants (R236fa and R245fa).
Proceedings ArticleDOI
Evaluation of performance and opportunities for improvements in automotive power electronics systems
TL;DR: In this article, the power electronic thermal management systems of two electric-drive vehicles (the 2012 Nissan LEAF and 2014 Honda Accord Hybrid) were characterized for both steadystate and transient conditions at various coolant flow rates.
Journal ArticleDOI
Drift Region Integrated Microchannels for Direct Cooling of Power Electronic Devices: Advantages and Limitations
TL;DR: In this paper, the authors present an original concept for efficient cooling of power devices based on the integration of a microchannel cooler, including numerous parallel through wafer fluid vias, directly into the drift region of the vertical power device and perpendicular to the PN junction of the device.
Proceedings ArticleDOI
Concepts for embedded cooling of vertical current wide band-gap semiconductor devices
TL;DR: In this article, three embedded cooling concepts for wide band gap (WBG) power semiconductor devices are described, where a multi-layer straight microchannel chip-scale cooler is fabricated and thermal-fluid performance characteristics of the device are experimentally plus numerically evaluated.