Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
Citations
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Journal ArticleDOI
Automotive Traction Inverters: Current Status and Future Trends
TL;DR: An independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers is presented, highlighting wide bandgap devices and trends in device packaging.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Journal ArticleDOI
Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles
Iqbal Husain,Burak Ozpineci,Sariful Islam,Emre Gurpinar,Gui-Jia Su,Wensong Yu,Shajjad Chowdhury,Lincoln Xue,Dhrubo Rahman,Raj Sahu +9 more
TL;DR: The electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance are discussed.
Journal ArticleDOI
Automotive Power Module Packaging: Current Status and Future Trends
TL;DR: This paper presents a comprehensive review of the automotive power module packaging technologies and concludes that a preferable overall performance could be achieved by combining multiple technologies.
Journal ArticleDOI
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
References
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High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
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A Survey of Wide Bandgap Power Semiconductor Devices
TL;DR: In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
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Graphite Nanoplatelet−Epoxy Composite Thermal Interface Materials
TL;DR: In this article, the performance of a few graphene layer n ∼ 4, with a thickness of ∼ 2 nm, was investigated for epoxy composites and it was shown that the G4 GNPs provide a thermal conductivity enhancement of more than 3000% (loading of ∼25 vol %).
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Fundamental issues related to flow boiling in minichannels and microchannels
TL;DR: In this article, the effects of the channel size on the flow patterns and heat transfer and pressure drop performance are reviewed in small hydraulic diameter channels, and the fundamental questions related to the presence of nucleate boiling and characteristics of flow boiling in microchannels and minichannels in comparison to that in the conventional channel sizes (3 mm and above) are addressed.
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Assessment of high-heat-flux thermal management schemes
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.