Showing papers on "Gallium nitride published in 2003"

Single-crystal gallium nitride nanotubes.

Abstract: Since the discovery of carbon nanotubes in 1991 (ref. 1), there have been significant research efforts to synthesize nanometre-scale tubular forms of various solids. The formation of tubular nanostructure generally requires a layered or anisotropic crystal structure. There are reports of nanotubes made from silica, alumina, silicon and metals that do not have a layered crystal structure; they are synthesized by using carbon nanotubes and porous membranes as templates, or by thin-film rolling. These nanotubes, however, are either amorphous, polycrystalline or exist only in ultrahigh vacuum. The growth of single-crystal semiconductor hollow nanotubes would be advantageous in potential nanoscale electronics, optoelectronics and biochemical-sensing applications. Here we report an 'epitaxial casting' approach for the synthesis of single-crystal GaN nanotubes with inner diameters of 30-200 nm and wall thicknesses of 5-50 nm. Hexagonal ZnO nanowires were used as templates for the epitaxial overgrowth of thin GaN layers in a chemical vapour deposition system. The ZnO nanowire templates were subsequently removed by thermal reduction and evaporation, resulting in ordered arrays of GaN nanotubes on the substrates. This templating process should be applicable to many other semiconductor systems.

Synthesis of p-Type Gallium Nitride Nanowires for Electronic and Photonic Nanodevices

Abstract: Magnesium-doped gallium nitride nanowires have been synthesized via metal-catalyzed chemical vapor deposition. Nanowires prepared on c-plane sapphire substrates were found to grow normal to the substrate, and transmission electron microscopy studies demonstrated that the nanowires had single-crystal structures with a 〈0001〉 growth axis that is consistent with substrate epitaxy. Individual magnesium-doped gallium nitride nanowires configured as field-effect transistors exhibited systematic variations in two-terminal resistance as a function of magnesium dopant incorporation, and gate-dependent conductance measurements demonstrated that optimally doped nanowires were p-type with hole mobilities of ca. 12 cm2/V‚s. In addition, transport studies of crossed gallium nitride nanowire structures assembled from p- and n-type materials show that these junctions correspond to well-defined p-n diodes. In forward bias, the p-n crossed nanowire junctions also function as nanoscale UV-blue light emitting diodes. The new synthesis of p-type gallium nitride nanowire building blocks opens up significant potential for the assembly of nanoscale electronics and photonics. Semiconductor nanowires (NWs) have demonstrated significant potential as fundamental building blocks for nanoelectronic and nanophotonic devices and also offer substantial

An assessment of wide bandgap semiconductors for power devices

Abstract: An advantage for some wide bandgap materials, that is often overlooked, is that the thermal coefficient of expansion (CTE) is better matched to the ceramics in use for packaging technology. It is shown that the optimal choice for uni-polar devices is clearly GaN. It is further shown that the future optimal choice for bipolar devices is C (diamond) owing to the large bandgap, high thermal conductivity, and large electron and hole mobilities. A new expression relating the critical electric field for breakdown in abrupt junctions to the material bandgap energy is derived and is further used to derive new expressions for specific on-resistance in power semiconductor devices. These new expressions are compared to the previous literature and the efficacy of specific power devices, such as heterojunction MOSFETs, using GaN are discussed.

Metalorganic Chemical Vapor Deposition Route to GaN Nanowires with Triangular Cross Sections

Abstract: High-quality gallium nitride nanowires have been synthesized via metal-initiated metalorganic chemical vapor deposition for the first time. Excellent substrate coverage was observed for wires prepared on silicon, c-plane, and a-plane sapphire substrates. The wires were formed via the vapor−liquid−solid mechanism with gold, iron, or nickel as growth initiators and were found to have widths of 15-200 nm. Transmission electron microscopy confirmed that the wires were single-crystalline and were oriented predominantly along the [210] or [110] direction. Wires growing along the [210] orientation were found to have triangular cross-sections. Transport measurements confirmed that the wires were n-type and had electron mobilities of ∼65 cm2/V·s. Photoluminescence measurements showed band edge emission at 3.35 eV (at 5 K), with a marked absence of low-energy emission from impurity defects.

Homoepitaxial gallium-nitride-based light emitting device and method for producing

Abstract: A light emitting device, such as a light emitting diode or a laser diode. The light emitting device comprises a light emitting semiconductor active region disposed on a substrate. The substrate comprises an optical absorption coefficient below about 100 cm−1 at wavelengths between 700 and 465 nm a GaN single crystal having a dislocation density of less than 104 per cm2 and an optical absorption coefficient below about 100 cm−1 at wavelengths between 700 and 465 nm. A method of making such a light emitting device is also provided.

Modelling of compound semiconductors: analytical bond-order potential for gallium, nitrogen and gallium nitride

Abstract: An analytical bond-order potential for GaN is presented that describes a wide range of structural properties of GaN as well as bonding and structure of the pure constituents. For the systematic fit of the potential parameters reference data are taken from total-energy calculations within the density functional theory if not available from experiments. Although long-range interactions are not explicitly included in the potential, the present model provides a good fit to different structural geometries including defects and high-pressure phases of GaN.

Defect reduction in (112̄0) a-plane gallium nitride via lateral epitaxial overgrowth by hydride vapor-phase epitaxy

Abstract: This letter reports on extended defect density reduction in m-plane (11¯00) GaN films achieved via lateral epitaxial overgrowth (LEO) by hydride vapor phase epitaxy. Several dielectric mask patterns were used to produce 10 to 100 μm-thick, partially and fully coalesced nonpolar GaN films. X-ray rocking curves indicated the films were free of wing tilt. Transmission electron microscopy showed that basal plane stacking fault (SF) and threading dislocation (TD) densities decreased from 105cm−1 and 109cm−2, respectively, less than 3×103cm−1 and ∼5×106cm−2, respectively, in the Ga-face (0001) wing of the LEO films. SFs persisted in ⟨0001⟩-oriented stripe LEO films, though TD reduction was observed in the windows and wings. Band-edge cathodoluminescence intensity increased 2 to 5 times in the wings compared to the windows depending on the stripe orientation. SFs in the low TD density wings of ⟨0001⟩-stripe films did not appear to act as nonradiative recombination centers.

Carrier mobility model for GaN

Abstract: Simple analytical approximation has been obtained to describe the temperature and concentration dependencies of the low-field mobility in gallium nitride (GaN) in wide temperature (50⩽ T ⩽1000 K) and concentration (10 14 ⩽ N ⩽10 19 cm −3 ) ranges. The dependence of the temperature T m at which the mobility μ is at a maximum on the doping level is also obtained. Results obtained can be directly used for computer simulation of GaN-based devices.

Y 3Al5 O 12 : Ce0.05 Phosphor Coatings on Gallium Nitride for White Light Emitting Diodes

Abstract: White light was obtained by mixing blue light from the emission of a gallium nitride (GaN) chip and yellow light from the fluorescence of a Y 3 Al 5 O 12 :Ce 0.05 yellow phosphor. A uniform coating and an optimized thickness of yellow phosphor layer on a GaN chip were necessary for achieving an efficient white light emitting diode. The phosphor particles were coated on a GaN chip or indium tin oxide by several methods including the slurry method, the settling method, and electrophoretic deposition (EPD). The properties of the phosphor layers prepared by these methods were examined using scanning electron microscope and photoluminescence. The chromaticity of white light was dependent upon the thickness of the phosphor layer. The properties of the phosphor layer prepared by EPD such as packing density, thickness, and uniformity could be more easily controlled than those by the slurry and settling methods. Further high packing density of the EPD could compensate for the typical thick phosphor layer, allowing the thin layer to be fabricated. To overcome the weak adhesion strength of phosphor particles by the EPD, an aqueous solution including poly(vinyl alcohol) + ammonium dichromate was coated on the phosphor layer and cured by exposure to ultraviolet light.

Single step pendeo-and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structures

Abstract: A method of fabricating a gallium nitride-based semiconductor structure on a substrate includes the steps of forming a mask having at least one opening therein directly on the substrate, growing a buffer layer through the opening, and growing a layer of gallium nitride upwardly from the buffer layer and laterally across the mask. During growth of the gallium nitride from the mask, the vertical and horizontal growth rates of the gallium nitride layer are maintained at rates sufficient to prevent polycrystalline material nucleating on said mask from interrupting the lateral growth of the gallium nitride layer. In an alternative embodiment, the method includes forming at least one raised portion defining adjacent trenches in the substrate and forming a mask on the substrate, the mask having at least one opening over the upper surface of the raised portion. A buffer layer may be grown from the upper surface of the raised portion. The gallium nitride layer is then grown laterally by pendeoepitaxy over the trenches.

Semiconductor light emitting device and method for producing the same

Abstract: A light emitting device employing gallium nitride type compound semiconductor which generates no crystal defect, dislocation and can be separated easily to chips by cleavage and a method for producing the same are provided. As a substrate on which gallium nitride type compound semiconductor layers are stacked, a gallium nitride type compound semiconductor substrate, a single-crystal silicon, a group II-VI compound semiconductor substrate, or a group III-V compound semiconductor substrate is employed.

Congruent melting of gallium nitride at 6 GPa and its application to single-crystal growth.

Abstract: The synthesis of large single crystals of GaN (gallium nitride) is a matter of great importance in optoelectronic devices for blue-light-emitting diodes and lasers. Although high-quality bulk single crystals of GaN suitable for substrates are desired, the standard method of cooling its stoichiometric melt has been unsuccessful for GaN because it decomposes into Ga and N2 at high temperatures before its melting point. Here we report that applying high pressure completely prevents the decomposition and allows the stoichiometric melting of GaN. At pressures above 6.0 GPa, congruent melting of GaN occurred at about 2,220 °C, and decreasing the temperature allowed the GaN melt to crystallize to the original structure, which was confirmed by in situ X-ray diffraction. Single crystals of GaN were formed by cooling the melt slowly under high pressures and were recovered at ambient conditions.

Nitride Semiconductors: Handbook on Materials and Devices

Abstract: Preface.List of Contributors.PART 1: MATERIAL.1. High-Pressure Crystallization of GaN (I. Grzegory, et al.).2. Epitaxial Lateral Overgrowth of GaN (P. Gibart, et al.).3. Plasma-Assisted Molecular Beam Epitaxy of III-V Nitrides (A. Georgakilas, et al.).4. Growth of Gallium Nitride by Hydride Vapor Phase Epitaxy (A. Trassoudaine, et al.).5. Growth and Properties of InN (V. Davydov, et al.).6. Surface Structure and Adatom Kinetics of Group-III Nitrides (J. Neugebauer).PART 2: DEFECTS AND INTERFACES.7. Topological Analysis of Defects in Nitride Semiconductors (G. Dimitrakopulos, et al.).8. Extended Defects in Wurtzite GaN Layers: Atomic Structure, Formation, and Interaction Mechanisms (P. Ruterana, et al.).9. Stain, Chemical Composition, and Defects Analysis at Atomic Level in GaN-based Epitaxial Layers (S. Kret, et al.).PART 3: PROCESSING AND DEVICES.10. Ohmic Contacts to GaN (P. Hartlieb, et al.). 11. Electroluminescent Diodes and Laser Diodes (H. Amano).12. GaN-Based Modulation-Doped FETs and Heterojunction Bipolar Transistors ( H. Morkoc & L. Liu).13. GaN-Based UV Photodetectors (F. Omnes & E. Monroy).Subject Index.

Method for manufacturing gallium nitride compound semiconductor

Abstract: An Al0.15Ga0.85N layer 2 is formed on a silicon substrate 1 in a striped or grid pattern. A GaN layer 3 is formed in regions A where the substrate 1 is exposed and in regions B which are defined above the layer 2. At this time, the GaN layer grows epitaxially and three-dimensionally (not only in a vertical direction but also in a lateral direction) on the Al0.15Ga0.85N layer 2. Since the GaN layer grows epitaxially in the lateral direction as well, a GaN compound semiconductor having a greatly reduced number of dislocations is obtained in lateral growth regions (regions A where the substrate 1 is exposed).

Highly efficient gallium nitride based light emitting diodes via surface roughening

Abstract: A gallium nitride (GaN) based light emitting diode (LED), wherein light is extracted through a nitrogen face (N-face) (42) of the LED and a surface of the N-face (42) is roughened into one or more hexagonal shaped cones. The roughened surface reduces light reflections occurring repeatedly inside the LED, and thus extracts more light out of the LED. The surface of the N-face (42) is roughened by an anisotropic etching, which may comprise a dry etching or a photo-enhanced chemical (PEC) etching.

Correlation of device performance and defects in AlGaN/GaN high-electron mobility transistors

Abstract: Device performance and defects in AlGaN/GaN high-electron mobility transistors (HEMTs) have been correlated. Surface depressions and threading dislocations, revealed by optical-defect mapping and atomic force microscopy (AFM), compromised the effectiveness of the SiNx surface-passivation effect as evidenced by the gate-lag measurements. The residual carriers in the GaN-buffer layer observed from the capacitance-voltage depth profile have been attributed to the point defects and threading dislocations either acting as donors or causing local charge accumulations. Deep-level transient-spectroscopy measurements showed the existence of several traps corresponding to surface states and bulk-dislocation defects. The formation of electron-accumulation regions on the surface or (and) in the GaN-buffer layer was confirmed by currentvoltage measurements. This second, virtual gate formed by electron accumulations can deplete the channel and cause a large-signal gain collapse leading to degraded output power. A good correlation was established between the device performance and defects in AlGaN/GaN HEMT structure.

Structural and morphological characteristics of planar (112̄0) a-plane gallium nitride grown by hydride vapor phase epitaxy

Abstract: This letter discusses the structural and morphological characteristics of planar, nonpolar (1120) a-plane GaN films grown on (1102) r-plane sapphire by hydride vapor phase epitaxy. Specular films with thicknesses over 50 μm were grown, eliminating the severely faceted surfaces that have previously been observed for hydride vapor phase epitaxy-grown a-plane films. Internal cracks and crack healing, similar to that in c-plane GaN films, were observed. Atomic force microscopy revealed nanometer-scale pitting and steps on the film surfaces, with rms roughness of ∼2 nm. X-ray diffraction confirmed the films are solely a-plane oriented with on-axis (1120) and 30° off-axis (1010) rocking curve peak widths of 1040 and 3000 arcsec, respectively. Transmission electron microscopy revealed a typical basal plane stacking fault density of 4×105 cm−1. The dislocation content of the films consisted of predominately edge component (bedge=±[0001]) threading dislocations with a density of 2×1010 cm−2, and mixed-characte...

Metalorganic chemical vapor phase epitaxy of gallium-nitride on silicon

Abstract: GaN growth on Si is very attractive for low-cost optoelectronics and high-frequency, high-power electronics. It also opens a route towards an integration with Si electronics. Early attempts to grow GaN on Si suffered from large lattice and thermal mismatch and the strong chemical reactivity of Ga and Si at elevated temperatures. The latter problem can be easily solved using gallium-free seed layers as nitrided AlAs and AlN. The key problem for device structure growth on Si is the thermal mismatch leading to cracks for layer thicknesses above 1 μm. Meanwhile, several concepts for strain engineering exist as patterning, Al(Ga)N/GaN superlattices, and low-temperature (LT) AlN interlayers which enable the growth of device- relevant GaN thicknesses. The high dislocation density in the heteropitaxial films can be reduced by several methods which are based on lateral epitaxial overgrowth using ex-situ masking or patterning and by in-situ methods as masking with monolayer thick SiN. With the latter method in combination with strain engineering by LT-AlN interlayers dislocation densities around 109 cm−2 can be achieved for 2.5 μm thick device structures.

Gallium nitride material devices including an electrode-defining layer and methods of forming the same

Abstract: Gallium nitride material devices and methods of forming the same are provided. The devices include an electrode-defining layer. The electrode-defining layer typically has a via formed therein in which an electrode is formed (at least in part). Thus, the via defines (at least in part) dimensions of the electrode. In some cases, the electrode-defining layer is a passivating layer that is formed on a gallium nitride material region.

Ultraviolet light emitting diode

Abstract: A light emitting diode is disclosed. The diode includes a silicon carbide substrate having a first conductivity type, a first gallium nitride layer above the SiC substrate having the same conductivity type as the substrate, a superlattice on the GaN layer formed of a plurality of repeating sets of alternating layers selected from among GaN, InGaN, and AlInGaN, a second GaN layer on the superlattice having the same conductivity type as the first GaN layer, a multiple quantum well on the second GaN layer, a third GaN layer on the multiple quantum well, a contact structure on the third GaN layer having the opposite conductivity type from the substrate and the first GaN layer, an ohmic contact to the SiC substrate, and an ohmic contact to the contact structure.

Selective MOCVD growth of ZnO nanotips

Abstract: ZnO is a wide bandgap semiconductor with a direct bandgap of 3.32eV at room temperature. It is a candidate material for ultraviolet LED and laser. ZnO has an exciton binding energy of 60 meV, much higher than that of GaN. It is found to be significantly more radiation hard than Si, GaAs, and GaN, which is critical against wearing out during field emission. Furthermore, ZnO can also be made as transparent and highly conductive, or piezoelectric. ZnO nanotips can be grown at relatively low temperatures, giving ZnO a unique advantage over the other nanostructures of wide bandgap semiconductors, such as GaN and SiC. In the present work, we report the selective growth of ZnO nanotips on various substrates using metalorganic chemical vapor deposition. ZnO nanotips grown on various substrates are single crystalline, n-type conductive and show good optical properties. The average size of the base of the nanotips is 40 nm. The room temperature photoluminescence peak is very intense and sharp with a full-width-half-maximum of 120 meV. These nanotips have potential applications in field emission devices, near-field microscopy, and UV photonics.

Methods of fabricating aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment

Abstract: High electron mobility transistors (HEMTs) and methods of fabricating HEMTs are provided Devices according to embodiments of the present invention include a gallium nitride (GaN) channel layer and an aluminum gallium nitride (AlGaN) barrier layer on the channel layer. A first ohmic contact is provided on the barrier layer-to provide a source electrode and a second ohmic contact is also provided on the barrier layer and is spaced apart from the source electrode to provide a drain electrode. A GaN-based cap segment is provided on the barrier layer between the source electrode and the drain electrode. The GaN-based cap segment has a first sidewall adjacent and spaced apart from the source electrode and may have a second sidewall adjacent and spaced apart from the drain electrode. A non-ohmic contact is provided on the GaN-based cap segment to provide a gate contact. The gate contact has a first sidewall which is substantially aligned with the first sidewall of the GaN-based cap segment. The gate contact extends only a portion of a distance between the first sidewall and the second sidewall of the GaN-based cap segment.

Ga Vacancies as Dominant Intrinsic Acceptors in GaN Grown by Hydride Vapor Phase Epitaxy

Abstract: Positron annihilation measurements show that negative Ga vacancies are the dominant acceptors in n-type gallium nitride grown by hydride vapor phase epitaxy. The concentration of Ga vacancies decreases, from more than 1019 to below 1016 cm−3, as the distance from the interface region increases from 1 to 300 μm. These concentrations are the same as the total acceptor densities determined in Hall experiments. The depth profile of O is similar to that of VGa, suggesting that the Ga vacancies are complexed with the oxygen impurities.

Group iii-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates

Abstract: In a method for producing a resonant cavity light emitting device, a seed gallium nitride crystal (14) and a source material (30) are arranged in a nitrogen-containing superheated fluid (44) disposed in a sealed container (10) disposed in a multiple-zone furnace (50). Gallium nitride material is grown on the seed gallium nitride crystal (14) to produce a single-crystal gallium nitride substrate (106, 106'). Said growing includes applying a temporally varying thermal gradient (100, 100', 102, 102') between the seed gallium nitride crystal (14) and the source material (30) to produce an increasing growth rate during at least a portion of the growing. A stack of group III-nitride layers (112) is deposited on the single-crystal gallium nitride substrate (106, 106'), including a first mirror sub-stack (116) and an active region (120) adapted for fabrication into one or more resonant cavity light emitting devices (108, 150, 160, 170, 180).

Gallium nitride-based devices and manufacturing process

Abstract: A nitride semiconductor (34, 234) is grown on a silicon substrate (10, 210) by depositing a few mono-layers of aluminum (14,214) to protect the silicon substrate from ammonia used during the growth process, and then forming a nucleation layer (16, 216) from aluminum nitride and a buffer structure (32, 232) including multiple superlattices (18, 26, 218) of AlRGa(llR)N semiconductors having different compositions and having an intermediate layer (24, 224) of GaN or other Ga­rich nitride semiconductor. The resulting structure has superior crystal quality. The silicon substrate used in epitaxial growth may be removed before completion of the device so as to provide superior electrical properties in devices such as high-electron mobility transistors.

Effect of external strain on the conductivity of AlGaN/GaN high-electron-mobility transistors

Abstract: The changes in the conductance of the channel of Al0.3Ga0.7N/GaN high-electron-mobility transistor structures during the application of both tensile and compressive strain were measured. For a fixed Al mole fraction, the changes in the conductance were roughly linear over the range up to 2.7×108 N cm−2, with coefficients for planar devices of −6.0+/−2.5×10−10 S N−1 m−2 for tensile strain and +9.5+/−3.5×10−10 S N−1 m−2 for compressive strain. For mesa-isolated structures, the coefficients were smaller due to the reduced effect of the AlGaN strain, with values of 5.5+/−1.1×10−13 S N−1 m−2 for tensile strain and 4.8×10−13 S N−1 m−2 for compressive strain. The large changes in the conductance demonstrate that simple AlGaN/GaN heterostructures are promising for pressure and strain sensor applications.

Sacrificial template method of fabricating a nanotube

Abstract: Methods of fabricating uniform nanotubes are described in which nanotubes were synthesized as sheaths over nanowire templates, such as using a chemical vapor deposition process. For example, single-crystalline zinc oxide (ZnO) nanowires are utilized as templates over which gallium nitride (GaN) is epitaxially grown. The ZnO templates are then removed, such as by thermal reduction and evaporation. The completed single-crystalline GaN nanotubes preferably have inner diameters ranging from 30 nm to 200 nm, and wall thicknesses between 5 and 50 nm. Transmission electron microscopy studies show that the resultant nanotubes are single-crystalline with a wurtzite structure, and are oriented along the direction. The present invention exemplifies single-crystalline nanotubes of materials with a non-layered crystal structure. Similar “epitaxial-casting” approaches could be used to produce arrays and single-crystalline nanotubes of other solid materials and semiconductors. Furthermore, the fabrication of multi-sheath nanotubes are described as well as nanotubes having multiple longitudinal segments.

Growth of reduced dislocation density non-polar gallium nitride by hydride vapor phase epitaxy

Abstract: Lateral epitaxial overgrowth (LEO) of non-polar a-plane gallium nitride (GaN) films by hydride vapor phase epitaxy (HVPE) results in significantly reduced defect density.