S
Samuel Graham
Researcher at Georgia Institute of Technology
Publications - 361
Citations - 12423
Samuel Graham is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Thermal conductivity & Thin film. The author has an hindex of 48, co-authored 347 publications receiving 9774 citations. Previous affiliations of Samuel Graham include Merck & Co. & United States Military Academy.
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Influence of Interfacial Mixing on Thermal Boundary Conductance Across a Chromium/Silicon Interface
TL;DR: In this article, a series of Cr films are grown on Si substrates subject to various deposition conditions to control the growth around the Cr/Si boundary, and the thermal boundary conductance (h BD ) is measured with the transient thermoreflectance technique.
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Stability of inverted organic solar cells with ZnO contact layers deposited from precursor solutions
Bradley A. MacLeod,Bertrand J. Tremolet de Villers,Philip Schulz,Paul F. Ndione,Hyungchul Kim,Anthony J. Giordano,Kai Zhu,Seth R. Marder,Samuel Graham,Joseph J. Berry,Antoine Kahn,Dana C. Olson +11 more
TL;DR: In this paper, the stability of inverted organic solar cells with ZnO electron collecting interlayer that are solution-processed from zinc acetate (ZnAc) or diethylzinc (deZn) precursors was investigated.
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Higher recovery and better energy dissipation at faster strain rates in carbon nanotube bundles: an in-situ study.
Siddhartha Pathak,Ee J. Lim,Parisa Pour Shahid Saeed Abadi,Samuel Graham,Baratunde A. Cola,Julia R. Greer +5 more
TL;DR: It is proposed that it is the kinetics of attractive adhesive interactions between the individual carbon nanotubes within the VACNT matrix that governs morphology evolution and ensuing recoverability, and energy dissipation capability, as revealed by hysteresis in load-unload cycles.
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Void growth in 6061-aluminum alloy under triaxial stress state
TL;DR: In this article, void growth has been quantitatively characterized in an extruded 6061-wrought Al-alloy as a function of stress state in notch tensile test specimens.
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A practical extension of the 3ω method to multilayer structures
TL;DR: In this article, an improved data reduction method is used to extend the popular 3ω method to general layered geometries, which utilizes an unapproximated analytical solution, cast in terms of thermal impedance, to simultaneously measure thermal conductivity, thermal capacity, conductivity anisotropy, and interlayer contact resistance in multilayer planar structures.