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Proceedings ArticleDOI

Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment

TLDR
In this paper, the electrical integrity of wide band-gap gallium nitride (GaN) heterostructure devices is evaluated subject to Venus surface atmospheric conditions, and three unique device architectures were fabricated at Stanford Nanofabrication Facility and exposed in a Venus simulation chamber for 244 hours at the University of Arkansas Center for Space and Planetary Sciences.
Abstract
Further development of harsh environment electronics capable of uncooled operation under Venus surface atmospheric conditions (~460°C, ~92 bar, corrosive) would enable future missions to the surface of Venus to operate for up to a year. Wide band-gap gallium nitride (GaN) heterostructure devices are attractive candidates for Venus lander missions due to their ability to withstand high-temperature exposure. Here, we present the first assessment of the electrical integrity of GaN-based devices subject to Venus surface atmospheric conditions. Three unique device architectures were fabricated at the Stanford Nanofabrication Facility and exposed in a Venus simulation chamber for 244 hours at the University of Arkansas Center for Space and Planetary Sciences. The three device architectures tested were InAlN/GaN high electron mobility transistors (HEMTs), InAlN/GaN Hall-effect sensors, and AlGaN/GaN UV photo detectors, which all have potential applications in the collection and readout of sensor data from Venusian landers. After exposure, HEMT threshold voltage had shifted only ~1% and gate leakage current remained on the same order of magnitude, demonstrating stability of the IrOx gate under supercritical CO2 ambient. Fluctuations in drain current after exposure are attributed to thermal detrapping and electrically-activated trapping processes. Measurements of the InAlN/GaN 2DEG properties in virgin and exposed Hall-effect sensors were comparable. Furthermore, the Hall-effect sensors exhibited a maximum change of only +11.4% in current-scaled sensitivity and −6.6% in voltage-scaled sensitivity post-exposure. The UV photodetectors with 362 nm peak wavelength exhibited an average decrease in responsivity of 38% after exposure, which is thought to be due to strain relaxation or ohmic contact degradation. Similar performance of the InAlN/GaN HEMTs and Hall-effect sensors before and after exposure highlights the viability of this material platform for development of Venus surface electronics, while the decrease in AlGaN/GaN UV photocurrent requires further analysis to assess whether the AlGaN/Ga heterostructure is suitable for robust, Venus-capable electronics.

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Journal ArticleDOI

Printed Electronics for Extreme High Temperature Environments

TL;DR: In this paper , an additive manufacturing-based approach to fabricate electronic components including substrates, interconnects, and RF elements for high temperature applications has been presented, where gold-based electrical structures have been printed on 3D printed ceramic substrates.

GaN Ring Oscillators Operational at 500 °C Based on a GaN-on-Si Platform

TL;DR: In this paper , a GaN-on-Si technology based on enhancement-mode p-GaN-gate AlGaN/GaN high electron mobility transistors (HEMTs) and depletion-mode alGaN and GaN HEMTs was proposed and used to implement different digital circuit configurations, namely E/D-mode and E/E-mode (E: enhancement, D: depletion).
Journal ArticleDOI

GaN Memory Operational at 300 °C

TL;DR: The most commonly used memory cells, namely a 32-bit read-only memory, a 1-bit 4-transistor static random-access memory, D latch, and D flip-flop (DFF), were demonstrated using high temperature (HT) GaN technology on a monolithically integrated GaN-on-Si platform and n-FET-only E/D-mode logic (E: enhancement, D: depletion) as discussed by the authors .

GaN Memory Operational at 300 °C

TL;DR: In this article , the most commonly used memory cells, namely a 32-bit read-only memory, a 1-bit 4-transistor static random-access memory, D latch, and D flip-flop (DFF), were demonstrated using high temperature (HT) GaN technology on a monolithically integrated GaN-on-Si platform and n-FET-only E/D-mode logic.
Journal ArticleDOI

Super-High-Frequency Low-Loss Sezawa Mode SAW Devices in a GaN/SiC Platform

TL;DR: In this article , the authors present a comprehensive study of the performance of Sezawa surface acoustic wave (SAW) devices in SweGaN QuanFINE® ultrathin GaN/SiC platform, reaching frequencies above 14 GHz for the first time.
References
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Journal ArticleDOI

Wide-bandgap semiconductor ultraviolet photodetectors

TL;DR: In this paper, a general review of the advances in widebandgap semiconductor photodetectors is presented, including SiC, diamond, III-nitrides and ZnS.
Journal ArticleDOI

High-temperature electronics - a role for wide bandgap semiconductors?

TL;DR: It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300/spl deg/C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range.
Journal ArticleDOI

New concept ultraviolet photodetectors

TL;DR: In this paper, the authors focused on the perspective of molding devices through exploring new materials and novel architectures inspired by state-of-the-art UV photodetectors.
Journal ArticleDOI

Testing the Temperature Limits of GaN-Based HEMT Devices

TL;DR: In this paper, the high temperature stability of AlGaN/GaN and lattice-matched InAlN/GAN heterostructure FETs has been evaluated by a stepped temperature test routine under large-signal operation.
Journal ArticleDOI

High-Temperature Operation of AlGaN/GaN HEMTs Direct-Coupled FET Logic (DCFL) Integrated Circuits

TL;DR: In this article, the authors present the high-temperature performance of AlGaN/GaN HEMT direct-coupled FET logic (DCFL) integrated circuits.
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