P
P. Montanini
Researcher at STMicroelectronics
Publications - 3
Citations - 204
P. Montanini is an academic researcher from STMicroelectronics. The author has contributed to research in topics: CMOS & Silicon on insulator. The author has an hindex of 3, co-authored 3 publications receiving 191 citations.
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Proceedings ArticleDOI
A manufacturable dual channel (Si and SiGe) high-k metal gate CMOS technology with multiple oxides for high performance and low power applications
Siddarth A. Krishnan,Unoh Kwon,Naim Moumen,Matthew W. Stoker,Eric C. Harley,Stephen W. Bedell,Deleep R. Nair,B. Greene,William K. Henson,Murshed M. Chowdhury,D.P. Prakash,Ernest Y. Wu,Dimitris P. Ioannou,Eduard A. Cartier,Myung-Hee Na,S. Inumiya,Kevin McStay,Lisa F. Edge,Ryosuke Iijima,Jin Cai,Martin M. Frank,M. Hargrove,Dechao Guo,Andreas Kerber,Hemanth Jagannathan,Takashi Ando,Joseph F. Shepard,Shahab Siddiqui,Min Dai,Huiming Bu,J. Schaeffer,Jaeger Daniel,Kathy Barla,Thomas A. Wallner,S. Uchimura,Y. Lee,Gauri Karve,Sufi Zafar,Dominic J. Schepis,Yun-Yu Wang,Ricardo A. Donaton,S. Saroop,P. Montanini,Yue Liang,James H. Stathis,Richard Carter,Rohit Pal,Vamsi Paruchuri,H. Yamasaki,J-H Lee,Martin Ostermayr,J.-P. Han,Yue Hu,Michael A. Gribelyuk,Dae-Gyu Park,X. Chen,Srikanth Samavedam,Shreesh Narasimha,Paul D. Agnello,Mukesh Khare,R. Divakaruni,Vijay Narayanan,Michael P. Chudzik +62 more
TL;DR: In this article, the authors leverage the superior mobility, low threshold voltage and NBTI of cSiGe channels in high-performance (HP) and low power (LP) high-к/metal gate (HKMG) logic MOSFETs with multiple oxides utilizing dual channels for nFET and pFET.
Proceedings ArticleDOI
A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOI
Kang-ill Seo,Balasubramanian S. Pranatharthi Haran,Dinesh Gupta,Dechao Guo,Theodorus E. Standaert,Ruilong Xie,H. Shang,E. Alptekin,D.I. Bae,Geum-Jong Bae,Carol Boye,H. Cai,D. Chanemougame,Robin Chao,Kangguo Cheng,Jin Cho,Kisik Choi,B. Hamieh,J. G. Hong,Terence B. Hook,L. Jang,Ju-Hwan Jung,R. Jung,Deok-Hyung Lee,B. Lherron,R. Kambhampati,Bomsoo Kim,Hoon Kim,K. Kim,Tae-Chan Kim,S.-B. Ko,Fee Li Lie,Derrick Liu,H. Mallela,Erin Mclellan,Sanjay Mehta,P. Montanini,M. Mottura,J. Nam,S. Nam,F. Nelson,Injo Ok,Chanro Park,Young-Kwan Park,Abhijeet Paul,Christopher Prindle,Ravikumar Ramachandran,Muthumanickam Sankarapandian,V. Sardesai,Andreas Scholze,Soon-Cheon Seo,Jeffrey C. Shearer,Richard G. Southwick,Raghavasimhan Sreenivasan,S. Stieg,Jay W. Strane,Xiao Sun,Min Gyu Sung,Charan V. V. S. Surisetty,Gen Tsutsui,Neeraj Tripathi,Reinaldo A. Vega,Christopher J. Waskiewicz,M. Weybright,C.-C. Yeh,Huiming Bu,Sean D. Burns,Donald F. Canaperi,M. Celik,Matthew E. Colburn,Hemanth Jagannathan,S. Kanakasabaphthy,Walter Kleemeier,Lars W. Liebmann,D. McHerron,Philip J. Oldiges,Vamsi Paruchuri,Terry A. Spooner,James H. Stathis,R. Divakaruni,T. Gow,John Iacoponi,J. Jenq,R. Sampson,Mukesh Khare +84 more
TL;DR: A 10nm logic platform technology is presented for low power and high performance application with the tightest contacted poly pitch (CPP) of 64nm and metallization pitch of 48nm ever reported in the FinFET technology on both bulk and SOI substrate.
Proceedings ArticleDOI
10nm FINFET technology for low power and high performance applications
Dechao Guo,H. Shang,Kang-ill Seo,Balasubramanian S. Pranatharthi Haran,Theodorus E. Standaert,Dinesh Gupta,E. Alptekin,D.I. Bae,Geum-Jong Bae,D. Chanemougame,Kangguo Cheng,Jin Cho,B. Hamieh,J. G. Hong,T. Hook,Ju-Hwan Jung,R. Kambhampati,Bomsoo Kim,Hoon Kim,K. Kim,Tae-Chan Kim,Derrick Liu,H. Mallela,P. Montanini,M. Mottura,S. Nam,Injo Ok,Young-Kwan Park,Abhijeet Paul,Christopher Prindle,Ravikumar Ramachandran,V. Sardesai,Andreas Scholze,Soon-Cheon Seo,Richard G. Southwick,Jay W. Strane,Xiao Sun,Gen Tsutsui,Neeraj Tripathi,Reinaldo A. Vega,M. Weybright,Ruilong Xie,C.-C. Yeh,Huiming Bu,Sean D. Burns,Donald F. Canaperi,M. Celik,Matthew E. Colburn,Hemanth Jagannathan,S. Kanakasabaphthy,Walter Kleemeier,Lars W. Liebmann,D. McHerron,Philip J. Oldiges,Vamsi Paruchuri,Terry A. Spooner,James H. Stathis,R. Divakaruni,T. Gow,John Iacoponi,J. Jenq,R. Sampson,W. Yang,Mukesh Khare +63 more
TL;DR: In this paper, a 10nm CMOS platform technology for low power and high performance applications with the tightest contacted poly pitch (CPP) of 64nm and metallization pitch of 48nm was reported in the FinFET technology on both bulk and SOI substrates.