Institution
Cadence Design Systems
Company•San Jose, California, United States•
About: Cadence Design Systems is a company organization based out in San Jose, California, United States. It is known for research contribution in the topics: Circuit design & Routing (electronic design automation). The organization has 3139 authors who have published 3745 publications receiving 66410 citations. The organization is also known as: Cadence Design Systems, Inc.
Topics: Circuit design, Routing (electronic design automation), Integrated circuit, Integrated circuit design, Physical design
Papers published on a yearly basis
Papers
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02 Dec 2002TL;DR: A unified theory of process variation is presented that includes inter-chip variation, intra- chip deterministic variation, and intra-chip statistical variation that allows for less pessimistic timing numbers and address yield optimization in the design process.
Abstract: Each manufactured chip is a little bit different, and designers want as many as possible of these chips to work. Process variation is a function of many variables, as the width, thickness, and inter-layer thickness can vary independently for each layer on a chip, as can temperature and voltage. Currently designers cope with this by picking a few subsets of these conditions, called process corners, and analyzing at these conditions. However, it's easy to show this approach is both too conservative (the specified conditions will seldom occur) and not conservative enough (it misses errors that can occur due to process variation). We present a unified theory of process variation that includes inter-chip variation, intra-chip deterministic variation (such as caused by proximity effects and metal density), and intra-chip statistical variation. Using this mechanism, we can explicitly compute performance as a function of process variation. This allows us to compute less pessimistic timing numbers and address yield optimization in the design process.
42 citations
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26 Oct 1993TL;DR: In this article, a crosstalk analysis system that uses automatically extracted circuit timing information to calculate real-world CRSstalk estimates is presented. But the system is not suitable for CRS analysis in the presence of noisy neighbor nets.
Abstract: A crosstalk analysis system that uses automatically extracted circuit timing information to calculate real-world crosstalk estimates. The crosstalk analysis system of the present invention improves the accuracy of crosstalk calculations by incorporating into the analysis automatically extracted inter-signal timing information. The present invention monitors a functional simulation run to automatically provide summary net activity time windows that are directly forward-annotated into a crosstalk analyzer. The crosstalk analyzer drastically reduces the number of crosstalk false alarms by avoiding summation of crosstalk noise between neighbor nets that switch out of phase with respect to each other.
42 citations
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05 Nov 2012TL;DR: This paper leverage and extend the 3D DfT wrapper for logic dies, such that, in conjunction with the boundary scan features in the Wide-I/O DRAM(s) stacked on top of it, testing the logic-memory interconnects is enabled.
Abstract: Three-dimensional (3D) die stacking is an emerging integration technology which brings benefits with respect to heterogeneous integration, inter-die interconnect density, performance, and energy efficiency, and component size and yield. In the past, we have described, for logic-on-logic die stacks, a 3D DfT (Design-for-Test) architecture and corresponding automation, based on die-level wrappers. Memory-on-logic stacks are among the first 3D products that will come to the market. Recently, JEDEC has released a standard for stackable Wide-I/O Mobile DRAMs (Dynamic Random Access Memories) which specifies the logic-memory interface. The standard includes boundary scan features in the DRAM memories. In this paper, we leverage and extend the 3D DfT wrapper for logic dies, such that, in conjunction with the boundary scan features in the Wide-I/O DRAM(s) stacked on top of it, testing the logic-memory interconnects is enabled. A dedicated Interconnect ATPG (Automatic Test Pattern Generation) algorithm is used to deliver effective and efficient dedicated test patterns. We have verified our proposed DfT extension on an industrial design and shown that the silicon area cost of the extended wrapper with JEDEC Wide-I/O interconnect test support is negligible.
42 citations
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10 Aug 2007
TL;DR: Four design flows are presented that can tackle large designs without significant changes with respect to synchronous design flow, and offer a trade-off from very low overhead, almost synchronous implementations, to very high performance, extremely robust dual-rail pipelines.
Abstract: The number of gates on a chip is quickly growing toward and beyond the one billion mark. Keeping all the gates running at the beat of a single or a few rationally related clocks is becoming impossible. In static timing analysis process variations and signal integrity issues stretch the timing margins to the point where they become too conservative and result in significant overdesign. Importance and difficulty of such problems push some developers to once again turn to asynchronous alternatives.
However, the electronics industry for the most part is still reluctant to adopt asynchronous design (with a few notable exceptions) due to a common belief that we still lack a commercial-quality Electronic Design Automation tools (similar to the synchronous RTL-to-GDSII flow) for asynchronous circuits.
The purpose of this paper is to counteract this view by presenting design flows that can tackle large designs without significant changes with respect to synchronous design flow. We are limiting ourselves to four design flows that we believe to be closest to this goal. We start from the Tangram flow, because it is the most commercially proven and it is one of the oldest from a methodological point of view.
The other three flows (Null Convention Logic, de-synchronization, and gate-level pipelining) could be considered together as asynchronous re-implementations of synchronous (RTL-or gate-level) specifications. The main common idea is substituting the global clocks by local synchronizations. Their most important aspect is to open the possibility to implement large legacy synchronous designs in an almost "push button" manner, where all asynchronous machinery is hidden, so that synchronous RTL designers do not need to be re-educated. These three flows offer a trade-off from very low overhead, almost synchronous implementations, to very high performance, extremely robust dual-rail pipelines.
42 citations
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11 Aug 2008TL;DR: In this article, a user can edit sub-masters content of selected instances of an electronic layout design, including editing the contents of an existing sub-master of an EDA design, and binding the new submaster to the selected instances without losing the design hierarchy.
Abstract: Systems and methods to enable a user to edit subMaster content of selected instances of an electronic layout design, including editing the contents of selected instances of an existing subMaster of an EDA design, generating a new subMaster to incorporate the modified contents of the selected instances, and binding the new subMaster to the selected instances without losing the design hierarchy of the layout design.
41 citations
Authors
Showing all 3142 results
Name | H-index | Papers | Citations |
---|---|---|---|
Alberto Sangiovanni-Vincentelli | 99 | 934 | 45201 |
Derong Liu | 77 | 608 | 19399 |
Andrew B. Kahng | 76 | 618 | 24097 |
Jason Cong | 76 | 594 | 24773 |
Kenneth L. McMillan | 60 | 150 | 20835 |
Edoardo Charbon | 60 | 526 | 12293 |
Richard B. Fair | 59 | 205 | 14653 |
John P. Hayes | 58 | 302 | 11206 |
Sachin S. Sapatnekar | 56 | 424 | 12543 |
Wayne G. Paprosky | 56 | 196 | 10571 |
Robert G. Meyer | 49 | 116 | 13011 |
Scott M. Sporer | 49 | 150 | 8085 |
Charles J. Alpert | 49 | 224 | 8287 |
Joao Marques-Silva | 48 | 289 | 9374 |
Paulo Flores | 48 | 321 | 7617 |