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Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors

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TLDR
In this paper, the origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally.
Abstract
The origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally. Based on an analysis of the electrostatics, surface states are identified as an important source of electrons. The role of the polarization-induced dipole is also clarified. Experimental Hall data for nominally undoped Al0.34Ga0.66N/GaN structures indicate that ∼1.65 eV surface donors are the actual source of the electrons in the 2DEG, which forms only when the barrier thickness exceeds 35 A.

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Citations
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Proceedings ArticleDOI

GaN lattice matched ZnO/Pr 2 O 3 film as gate dielectric oxide layer for AlGaN/GaN HEMT

TL;DR: ZnO/Pr 2 O 3 dielectric was used in this article for low leakage current of AlGaN/GaN based MOS-HEMT, which showed superior breakdown voltage performance compared to conventional Ni/Au HEMT.
Journal ArticleDOI

The effect of negative substrate bias on the electrical characteristics of InAlN/GaN MIS-HEMTs

TL;DR: In this article, the effect of negative substrate bias on the device performance of the InAlN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) was studied.
Journal ArticleDOI

Study on the electron mobility related with ohmic contact width in AlGaN/GaN HEMTs

TL;DR: For the fabricated AlGaN/GaN high electron mobility transistors (HEMTs) with different Ohmic contact widths, the gate-channel electron mobility is obtained experimentally.
Proceedings ArticleDOI

Modeling of 2DEG and 2DHG in i-GaN capped AlGaN/AlN/GaN HEMTs

TL;DR: In this article, a 2D drift-diffusion model with Schrodinger-Poisson quantum corrections using ATLAS toolbox by Silvaco is calibrated against experimental 1 μm gate length GaN-based high electron mobility transistor (HEMT).
Journal ArticleDOI

Simulation of temperature and electric field-dependent barrier traps effects in AlGaN/GaN HEMTs

TL;DR: In this article, the authors considered electron trapping and detrapping processes in the AlGaN barrier of high electron mobility transistors as that trapping is the process of electrons directly tunneling from the gate metal into the barrier traps while detrappping is electrons emission from the traps into the conduction band by phonon-assisted tunneling.
References
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Journal ArticleDOI

Spontaneous polarization and piezoelectric constants of III-V nitrides

TL;DR: In this paper, the spontaneous polarization, dynamical Born charges, and piezoelectric constants of the III-V nitrides AlN, GaN, and InN are studied ab initio using the Berry-phase approach to polarization in solids.
Journal ArticleDOI

Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
Journal ArticleDOI

Quantum-Confined Stark Effect due to Piezoelectric Fields in GaInN Strained Quantum Wells

TL;DR: In this article, the influence of piezoelectric fields on luminescence properties of GaInN strained quantum wells was studied and it was shown that an electric field of 1.08 MV/cm is induced by the piezolectric effect in strained Ga0.87In0.13N grown on GaN.
Journal ArticleDOI

Valence‐band discontinuities of wurtzite GaN, AlN, and InN heterojunctions measured by x‐ray photoemission spectroscopy

TL;DR: In this paper, the valence band discontinuities at various wurtzite GaN, AlN, and InN heterojunctions were measured by means of x-ray photoemission spectroscopy.
Journal ArticleDOI

Very high breakdown voltage and large transconductance realized on gan heterojunction field effect transistors

TL;DR: In this article, the authors reported record high breakdown voltages up to 340 and 230 V realized on unintentionally doped (1.5 μm gate length) and Si doped(1 μm/GaN modulation doped field effect transistors (MODFETs), respectively.
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