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Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors

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TLDR
In this paper, the origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally.
Abstract
The origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally. Based on an analysis of the electrostatics, surface states are identified as an important source of electrons. The role of the polarization-induced dipole is also clarified. Experimental Hall data for nominally undoped Al0.34Ga0.66N/GaN structures indicate that ∼1.65 eV surface donors are the actual source of the electrons in the 2DEG, which forms only when the barrier thickness exceeds 35 A.

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Theory of Modern Electronic Semiconductor Devices

TL;DR: In this paper, the authors present an overview of the state-of-the-art SEMICONDUCTOR DEVICE TRENDS, including the following: 1.1 Formation of Heterostructures. 2.2 Modulation Doping. 3.3 Base Transport Dynamics. 4.4 Nonstationary Transport Effects and Breakdown.
Journal ArticleDOI

AlGaN/GaN biosensor—effect of device processing steps on the surface properties and biocompatibility

TL;DR: In this article, the impact of typical device processing steps (KOH, HCl, HF wet chemical etching, SF 6 and Cl plasma etching) on the surface properties (roughness, chemical composition, contact angle to water) of group III-nitride based chemical sensors is investigated with emphasis on the electrical performance of the sensor and the biocompatibility.
Journal ArticleDOI

Distribution of donor states on etched surface of AlGaN/GaN heterostructures

TL;DR: In this article, the dependence of electron density on AlGaN barrier thickness (dAlGaN) was studied for single heterostructures with low-power reactive ion etching (RIE) instead of growth.
Journal ArticleDOI

Influence of Field Plate on the Transient Operation of the AlGaN/GaN HEMT

TL;DR: In this paper, a link between the AlGaN/GaN high-electron-mobility transistor (HEMT) field plate and the rate of reoccupation of surface traps is presented.
Journal ArticleDOI

Transient characteristics of GaN-based heterostructure field-effect transistors

TL;DR: In this article, the authors compared the thermal and electronic transients of different GaN-based FET structures, and found that the thermal transients are mainly reflected in changes in channel carrier mobility, while the electronic ones are dominated by charge instabilities caused by the polar nature of the material.
References
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Journal ArticleDOI

Spontaneous polarization and piezoelectric constants of III-V nitrides

TL;DR: In this paper, the spontaneous polarization, dynamical Born charges, and piezoelectric constants of the III-V nitrides AlN, GaN, and InN are studied ab initio using the Berry-phase approach to polarization in solids.
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Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
Journal ArticleDOI

Quantum-Confined Stark Effect due to Piezoelectric Fields in GaInN Strained Quantum Wells

TL;DR: In this article, the influence of piezoelectric fields on luminescence properties of GaInN strained quantum wells was studied and it was shown that an electric field of 1.08 MV/cm is induced by the piezolectric effect in strained Ga0.87In0.13N grown on GaN.
Journal ArticleDOI

Valence‐band discontinuities of wurtzite GaN, AlN, and InN heterojunctions measured by x‐ray photoemission spectroscopy

TL;DR: In this paper, the valence band discontinuities at various wurtzite GaN, AlN, and InN heterojunctions were measured by means of x-ray photoemission spectroscopy.
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Very high breakdown voltage and large transconductance realized on gan heterojunction field effect transistors

TL;DR: In this article, the authors reported record high breakdown voltages up to 340 and 230 V realized on unintentionally doped (1.5 μm gate length) and Si doped(1 μm/GaN modulation doped field effect transistors (MODFETs), respectively.
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