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Journal ArticleDOI

Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors

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TLDR
In this paper, the origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally.
Abstract
The origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally. Based on an analysis of the electrostatics, surface states are identified as an important source of electrons. The role of the polarization-induced dipole is also clarified. Experimental Hall data for nominally undoped Al0.34Ga0.66N/GaN structures indicate that ∼1.65 eV surface donors are the actual source of the electrons in the 2DEG, which forms only when the barrier thickness exceeds 35 A.

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Citations
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Book ChapterDOI

2D Simulation of Static Interface States in GaN HEMT with AlN/GaN Super-Lattice as Barrier Layer

TL;DR: In this paper, a simulation of interface charge effects in GaN-based high-electron-mobility transistors (HEMT) with AlN/GaN super-lattice (SL) device is performed.

The Modulation Effect of LPCVD-SixNy Stoichiometry on 2-DEG Characteristic of UTB AlGaN/GaN Heterostructure

TL;DR: In this paper , the impact of low-pressure chemical vapor deposition (LPCVD)-sixNy stoichiometry on 2-D electron gas (2-DEG) transport characteristics of the AlGaN (3.9 nm)/GaN heterostructure and the underlying mechanism of increased 2DEG density are studied.
Journal ArticleDOI

AlGaN/GaN Metal Oxide Semiconductor High-Electron Mobility Transistors with Annealed TiO2 as Passivation and Dielectric Layers

Yu-Shyan Lin, +1 more
- 31 May 2023 - 
TL;DR: In this article , improved AlGaN/GaN metal oxide semiconductor high-electron mobility transistors (MOS-HEMTs) were reported to improve the quality of gate oxide by annealing at 300 °C in N2.
Journal ArticleDOI

Heterojunction Channel Engineering in Performance Enhancement of Solution-Processed Oxide Thin-Film Transistors

TL;DR: In this paper , the authors report the solution-based growth of InZnO/AlInZnOs (IZO/AIZO) heterojunction channel layers and their implementation in high-performance TFTs.
Journal ArticleDOI

An intensive study on effects of lateral scaling and gate metals on the RF/DC performance of recessed T-gated Fe-doped AlN/GaN/SiC HEMTs for future RF and microwave power applications

TL;DR: In this article , the effect of gate metals on the electrical performance of recessed T-gated Fe-doped AlN/GaN/SiC HEMT was investigated.
References
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Journal ArticleDOI

Spontaneous polarization and piezoelectric constants of III-V nitrides

TL;DR: In this paper, the spontaneous polarization, dynamical Born charges, and piezoelectric constants of the III-V nitrides AlN, GaN, and InN are studied ab initio using the Berry-phase approach to polarization in solids.
Journal ArticleDOI

Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
Journal ArticleDOI

Quantum-Confined Stark Effect due to Piezoelectric Fields in GaInN Strained Quantum Wells

TL;DR: In this article, the influence of piezoelectric fields on luminescence properties of GaInN strained quantum wells was studied and it was shown that an electric field of 1.08 MV/cm is induced by the piezolectric effect in strained Ga0.87In0.13N grown on GaN.
Journal ArticleDOI

Valence‐band discontinuities of wurtzite GaN, AlN, and InN heterojunctions measured by x‐ray photoemission spectroscopy

TL;DR: In this paper, the valence band discontinuities at various wurtzite GaN, AlN, and InN heterojunctions were measured by means of x-ray photoemission spectroscopy.
Journal ArticleDOI

Very high breakdown voltage and large transconductance realized on gan heterojunction field effect transistors

TL;DR: In this article, the authors reported record high breakdown voltages up to 340 and 230 V realized on unintentionally doped (1.5 μm gate length) and Si doped(1 μm/GaN modulation doped field effect transistors (MODFETs), respectively.
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