B
Brian J. Greene
Researcher at IBM
Publications - 86
Citations - 1418
Brian J. Greene is an academic researcher from IBM. The author has contributed to research in topics: Field-effect transistor & Layer (electronics). The author has an hindex of 19, co-authored 86 publications receiving 1393 citations. Previous affiliations of Brian J. Greene include GlobalFoundries & Chartered Semiconductor Manufacturing.
Papers
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Patent
Opto-thermal annealing methods for forming metal gate and fully silicided gate field effect transistors
Scott D. Allen,Cyril Cabral,Kevin K. Dezfulian,Sunfei Fang,Brian J. Greene,Rajarao Jammy,Christian Lavoie,Zhijiong Luo,Hung Ng,Chun-Yung Sung,C. Wann,Huilong Zhu +11 more
TL;DR: In this paper, an opto-thermal annealing method for forming a field effect transistor uses a reflective metal gate so that electrical properties of the metal gate and also interface between the gate and a gate dielectric are not compromised.
Proceedings ArticleDOI
High performance 14nm SOI FinFET CMOS technology with 0.0174µm 2 embedded DRAM and 15 levels of Cu metallization
C-H. Lin,Brian J. Greene,Shreesh Narasimha,J. Cai,A. Bryant,Carl J. Radens,Vijay Narayanan,Barry Linder,Herbert L. Ho,A. Aiyar,E. Alptekin,J-J. An,Michael V. Aquilino,Ruqiang Bao,V. Basker,Nicolas Breil,MaryJane Brodsky,William Y. Chang,Clevenger Leigh Anne H,Dureseti Chidambarrao,Cathryn Christiansen,D. Conklin,C. DeWan,H. Dong,L. Economikos,Bernard A. Engel,Sunfei Fang,D. Ferrer,A. Friedman,Allen H. Gabor,Fernando Guarin,Ximeng Guan,M. Hasanuzzaman,J. Hong,D. Hoyos,Basanth Jagannathan,S. Jain,S.-J. Jeng,J. Johnson,B. Kannan,Y. Ke,Babar A. Khan,Byeong Y. Kim,Siyuranga O. Koswatta,Amit Kumar,T. Kwon,Unoh Kwon,L. Lanzerotti,H-K Lee,W-H. Lee,A. Levesque,Wai-kin Li,Zhengwen Li,Wei Liu,S. Mahajan,Kevin McStay,Hasan M. Nayfeh,W. Nicoll,G. Northrop,A. Ogino,Chengwen Pei,S. Polvino,Ravikumar Ramachandran,Z. Ren,Robert R. Robison,Saraf Iqbal Rashid,Viraj Y. Sardesai,S. Saudari,Dominic J. Schepis,Christopher D. Sheraw,Shariq Siddiqui,Liyang Song,Kenneth J. Stein,C. Tran,Henry K. Utomo,Reinaldo A. Vega,Geng Wang,Han Wang,W. Wang,X. Wang,D. Wehelle-Gamage,E. Woodard,Yongan Xu,Y. Yang,N. Zhan,Kai Zhao,C. Zhu,K. Boyd,E. Engbrecht,K. Henson,E. Kaste,Siddarth A. Krishnan,Edward P. Maciejewski,Huiling Shang,Noah Zamdmer,R. Divakaruni,J. Rice,Scott R. Stiffler,Paul D. Agnello +98 more
TL;DR: In this article, the authors present a fully integrated 14nm CMOS technology featuring fin-FET architecture on an SOI substrate for a diverse set of SoC applications including HP server microprocessors and LP ASICs.
Patent
Structure and method for improved stress and yield in pFETS with embedded SiGe source/drain regions
TL;DR: In this article, the authors proposed a technique for forming a CMOS structure including at least one pFET that has a stressed channel, which avoids the formation of deep canyons at the interface between the active area and the trench isolation region, thereby eliminating the problems of silicide to source/drain shorts and contact issues.
Patent
Self-aligned well implant for improving short channel effects control, parasitic capacitance, and junction leakage
TL;DR: In this article, a self-aligned well implant for a transistor is proposed, where a patterned gate structure over a substrate, including a gate conductor, a gate dielectric layer and sidewall spacers, is constructed.
Proceedings Article
High performance 32nm SOI CMOS with high-k/metal gate and 0.149µm 2 SRAM and ultra low-k back end with eleven levels of copper
Brian J. Greene,Q. Liang,K. Amarnath,Y. Wang,J. Schaeffer,M. Cai,Yue Liang,S. Saroop,J. Cheng,A. Rotondaro,Shu-Jen Han,R. Mo,K. McStay,S.H. Ku,R. Pal,Mahender Kumar,B. Dirahoui,B. Yang,F. Tamweber,Woo-Hyeong Lee,M. Steigerwalt,H. Weijtmans,Judson R. Holt,L. Black,S. Samavedam,M. Turner,K. Ramani,D. Lee,Michael P. Belyansky,M. Chowdhury,D. Aime,B. Min,H. van Meer,Haizhou Yin,K.K. Chan,M. Angyal,M. Zaleski,O. Ogunsola,C. Child,L. Zhuang,H. Yan,D. Permanaa,Jeffrey W. Sleight,Dechao Guo,S. Mittl,D. Ioannou,Ernest Y. Wu,Michael P. Chudzik,D.-G. Park,D. Brown,Scott Luning,Dan Mocuta,Edward P. Maciejewski,K. Henson,Effendi Leobandung +54 more
TL;DR: In this paper, a 32 nm SOI CMOS technology featuring high-k/metal gate and an SRAM cell size of 0.149 µm2 is presented, enabling performance without the power penalty from gate capacitance.