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Proceedings ArticleDOI

A Low-Power Multi-Gate FET CMOS Technology with 13.9ps Inverter Delay, Large-Scale Integrated High Performance Digital Circuits and SRAM

TLDR
SRAM cells and product-typical critical paths with more than 10k transistors demonstrate the capability for large-scale integration and NAND and NOR show significant improvement in delay vs. stack height compared to bulk CMOS.
Abstract
This paper presents an in-depth analysis of digital performance of a Multi-Gate FET technology. Ring oscillators with metal gates and undopedfins show an inverter delay of 13.9ps at 1V, the highest performance of a Multi-Gate FET technology reported at 1.9nA off-current/stage. NAND and NOR show significant improvement in delay vs. stack height compared to bulk CMOS. SRAM cells and product-typical critical paths with more than 10k transistors demonstrate the capability for large-scale integration.

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Citations
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Proceedings ArticleDOI

Exploring sub-20nm FinFET design with predictive technology models

TL;DR: Predictive MOSFET models are critical for early stage design-technology co-optimization and circuit design research and PTM for FinFET devices are generated for 5 technology nodes corresponding to the years 2012-2020 on the ITRS roadmap.
Journal ArticleDOI

Si, SiGe Nanowire Devices by Top–Down Technology and Their Applications

TL;DR: The current technology status for realizing the GAA NW device structures and their applications in logic circuit and nonvolatile memories are reviewed and the challenges and opportunities are outlined.
Proceedings ArticleDOI

Sub-20 nm gate length FinFET design: Can high-κ spacers make a difference?

TL;DR: In this paper, a novel device design methodology for undoped underlapped FinFETs with high-kappa spacers is presented to achieve higher circuit speed and SRAM cells with higher stability, lower leakage, faster access times and higher robustness to process variations compared to overlapped finFET.
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How many transistors does SRAM use?

SRAM cells and product-typical critical paths with more than 10k transistors demonstrate the capability for large-scale integration.