Journal ArticleDOI
An 8 Mb Multi-Layered Cross-Point ReRAM Macro With 443 MB/s Write Throughput
Akifumi Kawahara,Ryotaro Azuma,Yuuichirou Ikeda,Ken Kawai,Yoshikazu Katoh,Kouhei Tanabe,Toshihiro Nakamura,Yoshihiko Sumimoto,Naoki Yamada,Nobuyuki Nakai,Shoji Sakamoto,Yukio Hayakawa,Kiyotaka Tsuji,Shinichi Yoneda,Atsushi Himeno,Kenichi Origasa,Kazuhiko Shimakawa,Takeshi Takagi,Takumi Mikawa,Kunitoshi Aono +19 more
- Vol. 48, Iss: 1, pp 178-185
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TLDR
An 8-Mb multi-layered cross-point resistive RAM (ReRAM) macro has been developed with 443 MB/s write throughput (64-bits parallel write per 17.2-ns cycle), which is almost twice as fast as competing methods.Abstract:
Nonvolatile memories with fast write operation at low voltage are required as storage devices to exceed flash memory performance [1–3]. We develop an 8Mb multi-layered cross-point ReRAM macro with 443MB/s write throughput (64b parallel write per 17.2ns cycle), which is almost twice as fast as existing methods, using the fast-switching performance of TaO x ReRAM [4] and the following three techniques to reduce the sneak current in bipolar type cross-point cell array structure in an 0.18μm process. First, memory cell and array technologies reduce the sneak current with a newly developed bidirectional diode as a memory cell select element for the first time. Second, we use a hierarchical bitline (BL) structure for multi-layered cross-point memory with fast and stable current control. Third, we implement a multi-bit write architecture that realizes fast write operation and suppresses sneak current. This work is applicable to both high-density stand-alone and embedded memory with more stacked memory arrays and/or scaling memory cells.read more
Citations
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Journal ArticleDOI
Memristive devices for computing
TL;DR: The performance requirements for computing with memristive devices are examined and how the outstanding challenges could be met are examined.
Journal ArticleDOI
Metal–Oxide RRAM
Hon-Sum Philip Wong,Heng-Yuan Lee,Shimeng Yu,Yu-Sheng Chen,Yi Wu,Pang-Shiu Chen,Byoungil Lee,Frederick T. Chen,Ming-Jinn Tsai +8 more
TL;DR: The physical mechanism, material properties, and electrical characteristics of a variety of binary metal-oxide resistive switching random access memory (RRAM) are discussed, with a focus on the use of RRAM for nonvolatile memory application.
Journal ArticleDOI
Training and operation of an integrated neuromorphic network based on metal-oxide memristors
Mirko Prezioso,Farnood Merrikh-Bayat,Brian D. Hoskins,Gina C. Adam,Konstantin K. Likharev,Dmitri B. Strukov +5 more
TL;DR: The experimental implementation of transistor-free metal-oxide memristor crossbars, with device variability sufficiently low to allow operation of integrated neural networks, in a simple network: a single-layer perceptron (an algorithm for linear classification).
Journal ArticleDOI
PRIME: a novel processing-in-memory architecture for neural network computation in ReRAM-based main memory
TL;DR: This work proposes a novel PIM architecture, called PRIME, to accelerate NN applications in ReRAM based main memory, and distinguishes itself from prior work on NN acceleration, with significant performance improvement and energy saving.
Journal ArticleDOI
Recent progress in resistive random access memories: Materials, switching mechanisms, and performance
TL;DR: A comprehensive review of the recent progress in the so-called resistive random access memories (RRAMs) can be found in this article, where a brief introduction is presented to describe the construction and development of RRAMs, their potential for broad applications in the fields of nonvolatile memory, unconventional computing and logic devices, and the focus of research concerning RRAMS over the past decade.
References
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Proceedings ArticleDOI
Highly reliable TaOx ReRAM and direct evidence of redox reaction mechanism
Zhiqiang Wei,Yoshihiko Kanzawa,Koji Arita,Yoshikazu Katoh,Ken Kawai,S. Muraoka,Satoru Mitani,S. Fujii,Koji Katayama,Mitsuteru Iijima,Takumi Mikawa,Takeki Ninomiya,Ryoko Miyanaga,Yoshio Kawashima,Kiyotaka Tsuji,Atsushi Himeno,Takashi Okada,Ryotaro Azuma,Kazuhiko Shimakawa,H. Sugaya,Takeshi Takagi,R. Yasuhara,K. Horiba,Hiroshi Kumigashira,Masaharu Oshima +24 more
TL;DR: Highly reliable TaOx ReRAM has been successfully demonstrated, showing stable pulse switching with endurance over 109 cycles, sufficient retention exceeding 10 years at 85degC and stable high and low resistance states based on the redox reaction mechanism.
Proceedings ArticleDOI
2-stack 1D-1R Cross-point Structure with Oxide Diodes as Switch Elements for High Density Resistance RAM Applications
Myoung-Jae Lee,Youngsoo Park,Bo Soo Kang,Seung-Eon Ahn,Chang-Bum Lee,Ki-Hwan Kim,Wenxu Xianyu,G. Stefanovich,Jung-Hyun Lee,Seok-Jae Chung,Yeon-hee Kim,Chang-Soo Lee,Jong-Bong Park,In-Kyeong Yoo +13 more
TL;DR: In this article, a 2-stack 8-times-8 array with 0.5 mumtimes0.5 cells was proposed to demonstrate the feasibility of high density stacked RRAM.
Proceedings ArticleDOI
A 64Mb MRAM with clamped-reference and adequate-reference schemes
Kenji Tsuchida,Tsuneo Inaba,Katsuyuki Fujita,Yoshihiro Ueda,Takafumi Shimizu,Yoshiaki Asao,Takeshi Kajiyama,Masayoshi Iwayama,Kuniaki Sugiura,Sumio Ikegawa,Tatsuya Kishi,Tadashi Kai,Minoru Amano,Naoharu Shimomura,Hiroaki Yoda,Yohji Watanabe +15 more
TL;DR: A 64Mb STTMRAM with the P-TMR device having the circuit techniques to maximize operational margin is described, and the perpendicular tunnel magnetoresistance (TMR) device is proposed, confirming its high potential to achieve lower switching current.
2-stack ID-IRCross-point Structure withOxideDiodes asSwitch Elements for HighDensity Resistance RAM Applications
Myoung-Jae Lee,Seung-Eon Ahn,Chang-Bum Lee,Jung-hyun Lee,Seok-Jae Chung,Chang-Soo Lee,In-Gyu Baek +6 more
TL;DR: In this paper, a 2-stack 8x8array ID-RRAM has been successfully integrated into a 2.5umx0.5u cells ID-IRstructures duetethe compatibility ofoxide in order to demonstrate the feasibility of highdensity stacked-based p-ndiodes and memory nodes.
Proceedings ArticleDOI
Demonstration of high-density ReRAM ensuring 10-year retention at 85°C based on a newly developed reliability model
Zhiqiang Wei,Takeshi Takagi,Yoshihiko Kanzawa,Yoshikazu Katoh,Takeki Ninomiya,Ken Kawai,S. Muraoka,Satoru Mitani,Koji Katayama,S. Fujii,Ryoko Miyanaga,Yoshio Kawashima,Takumi Mikawa,Kazuhiko Shimakawa,Kunitoshi Aono +14 more
TL;DR: In this paper, a new oxygen diffusion reliability model for a high-density bipolar ReRAM is developed based on hopping conduction in filaments, which allows statistical predication of activation energy.