Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films.
Nobumichi Tamura,Alastair A. MacDowell,Ralph Spolenak,B. C. Valek,John C. Bravman,W. L. Brown,Richard Celestre,Howard A. Padmore,B. W. Batterman,J. R. Patel +9 more
TLDR
Scanning X-ray microdiffraction (microSXRD) combines the use of high-brilliance synchrotron sources with the latest achromaticX-ray focusing optics and fast large-area two-dimensional-detector technology to study thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments.Abstract:
Scanning X-ray microdiffraction (µSXRD) combines the use of high-brilliance synchrotron sources with the latest achromatic X-ray focusing optics and fast large-area two-dimensional-detector technology. Using white beams or a combination of white and monochromatic beams, this technique allows for the orientation and strain/stress mapping of polycrystalline thin films with submicrometer spatial resolution. The technique is described in detail as applied to the study of thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments. It is shown that there are significant orientation and strain/stress variations between grains and inside individual grains. A polycrystalline film when investigated at the granular (micrometer) level shows a highly mechanically inhomogeneous medium that allows insight into its mesoscopic properties. If the µSXRD data are averaged over a macroscopic range, results show good agreement with direct macroscopic texture and stress measurements.read more
Citations
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Journal ArticleDOI
In-situ X-ray μLaue diffraction study of copper through-silicon vias
Dario Ferreira Sanchez,Shay Reboh,Monica Larissa Djomeni Weleguela,Jean-Sébastien Micha,Odile Robach,Thierry Mourier,Patrice Gergaud,Pierre Bleuet +7 more
TL;DR: An original in-situ strain investigation of a Cu through silicon vias (TSVs) sample using X-ray μLaue diffraction mapping using analytical and Finite Element Method analysis is developed.
Book ChapterDOI
The evolution of microstructure in copper interconnects during electromigration
TL;DR: In this paper, the key concepts and experimental techniques in investigating the evolution of microstructure in Cu interconnects during electromigration are discussed and some of the fundamental changes in the micro-structure during EMigration are described.
Journal ArticleDOI
Dislocation plasticity and detwinning under thermal stresses in nanotwinned Ag thin films
Maya K. Kini,Claudia Merola,Benjamin Breitbach,Dennis Klapproth,Bastian Philippi,Jean-Baptiste Molin,Christoph Kirchlechner,Gerhard Dehm +7 more
TL;DR: In this article, the deformation characteristics of an electron beam deposited epitaxial nanotwinned Ag on Si (111) substrate were studied for twin spacings varying from 20nm to 1μm.
Journal ArticleDOI
Application of the White/Monochromatic X-Ray μ-Diffraction Technique to the Study of Texture and Triaxial Strain at the Submicron Level
TL;DR: A scanning X-ray microdiffraction beamline using white or monochromatic beam has been recently made available to the user's community at the Advanced Light Source, Berkeley, USA.
DissertationDOI
Mechanical properties of ultra thin metallic films revealed by synchrotron techniques
TL;DR: In this article, synchrotron-based in situ testing techniques were developed and optimized in order to characterize the stress evolution in ultra thin metallic films on compliant polymer substrates during isothermal tensile tests.
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Journal ArticleDOI
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