Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films.
Nobumichi Tamura,Alastair A. MacDowell,Ralph Spolenak,B. C. Valek,John C. Bravman,W. L. Brown,Richard Celestre,Howard A. Padmore,B. W. Batterman,J. R. Patel +9 more
TLDR
Scanning X-ray microdiffraction (microSXRD) combines the use of high-brilliance synchrotron sources with the latest achromaticX-ray focusing optics and fast large-area two-dimensional-detector technology to study thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments.Abstract:
Scanning X-ray microdiffraction (µSXRD) combines the use of high-brilliance synchrotron sources with the latest achromatic X-ray focusing optics and fast large-area two-dimensional-detector technology. Using white beams or a combination of white and monochromatic beams, this technique allows for the orientation and strain/stress mapping of polycrystalline thin films with submicrometer spatial resolution. The technique is described in detail as applied to the study of thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments. It is shown that there are significant orientation and strain/stress variations between grains and inside individual grains. A polycrystalline film when investigated at the granular (micrometer) level shows a highly mechanically inhomogeneous medium that allows insight into its mesoscopic properties. If the µSXRD data are averaged over a macroscopic range, results show good agreement with direct macroscopic texture and stress measurements.read more
Citations
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Book ChapterDOI
Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence
TL;DR: In this article, it is shown that the interconnect texture is an important factor, governing the plastic response of Cu grains to the electrical current, and that the degree of plastic response is proportional with the availability of 〈112〉 direction in Cu crystals along the direction of the current.
Journal ArticleDOI
The Effect of U Atom Adsorption on the Structural, Electronic and Magnetic Properties of Single-Walled Carbon Nanotubes
TL;DR: In this article, the structural, electronic and magnetic properties of three types of single-walled carbon nanotubes (SWNTs, zigzag, armchair and chiral) with adsorption of a uranium (U) atom using density-functional theories were investigated.
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X-ray Laue Microdiffraction and Raman Spectroscopic Investigation of Natural Silicon and Moissanite
TL;DR: In this article, the authors analyzed SiC from a Miocene tuff-sandstone using synchrotron Laue microdiffraction and Raman spectroscopy, in order to better understand the SiC phases and formation physics.
Journal ArticleDOI
Understanding and Controlling Cu Protrusions in 3D TSV Processing
Seth Kruger,Klaus Hummler,Robert E. Geer,Kathleen Dunn,Colin McDonough,Aaron Cordes,Jack Enloe,Brian Sapp,Iqbal Ali,Pieper Stefan,Sitaram Arkalgud,Thomas Murray +11 more
TL;DR: In this paper, the authors report the underlying mechanisms as well as process remedies for Cu protrusions in TSV-mid processing flow, which is known as Cu protrusion, pumping or popping.
Journal ArticleDOI
X-ray Diffraction Imaging of Deformations in Thin Films and Nano-Objects
TL;DR: In this article , the authors present a review of the state-of-the-art in the field of X-ray imaging of elastic strains and defects in crystals, and propose a new accelerator ring concept (HMBA network: hybrid multi-bend achromat lattice).
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