Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films.
Nobumichi Tamura,Alastair A. MacDowell,Ralph Spolenak,B. C. Valek,John C. Bravman,W. L. Brown,Richard Celestre,Howard A. Padmore,B. W. Batterman,J. R. Patel +9 more
TLDR
Scanning X-ray microdiffraction (microSXRD) combines the use of high-brilliance synchrotron sources with the latest achromaticX-ray focusing optics and fast large-area two-dimensional-detector technology to study thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments.Abstract:
Scanning X-ray microdiffraction (µSXRD) combines the use of high-brilliance synchrotron sources with the latest achromatic X-ray focusing optics and fast large-area two-dimensional-detector technology. Using white beams or a combination of white and monochromatic beams, this technique allows for the orientation and strain/stress mapping of polycrystalline thin films with submicrometer spatial resolution. The technique is described in detail as applied to the study of thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments. It is shown that there are significant orientation and strain/stress variations between grains and inside individual grains. A polycrystalline film when investigated at the granular (micrometer) level shows a highly mechanically inhomogeneous medium that allows insight into its mesoscopic properties. If the µSXRD data are averaged over a macroscopic range, results show good agreement with direct macroscopic texture and stress measurements.read more
Citations
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Proceedings ArticleDOI
Understanding size effects in the advanced through-silicon via interconnect schemes for 3D ICs
Imran Ali,Ihor Radchenko,Sasi Kumar Tippabhotla,Song Wenjian M. Ridhuan,Andrew A. O. Tay,Nobumichi Tamura,Seung Min Han,Arief SuriadiBudiman +7 more
TL;DR: In this paper, the authors used Synchrotron X-ray microdiffraction to unravel how stresses evolve both in Cu through silicon via (TSV) as well as in silicon surrounding it.
Proceedings ArticleDOI
Investigation of thermo-mechanical stresses and reliability of 3D die-stack structures by synchrotron x-ray micro-diffraction
Tengfei Jiang,Peng Su,Patrick Kim,Cassie Bassett,Kevin Sichak,Jaspreet S. Gandhi,Jian Li,Jay Im,Rui Huang,Paul S. Ho +9 more
TL;DR: In this article, the authors investigated the thermo-mechanical stresses and reliability of 3D die-stack structures developed for the Hybrid Memory Cube (HMC) technology using experiments and modeling analysis.
DissertationDOI
Diffraction analysis of materials in a state of stress: elastic loading and phase transformations
TL;DR: In this paper, a combination of XRD techniques were applied for the investigation to measure the phase fraction (Rietveld analysis) and stresses (curvature and sin2psi methods) as a function of temperature.
Journal ArticleDOI
Strain mapping on gold thin film buckling and silicon blistering
Philippe Goudeau,Nobumichi Tamura,Guillaume Parry,J. Colin,Christophe Coupeau,F. Cleymand,Howard A. Padmore +6 more
TL;DR: In this paper, the authors show that micro Scanning X-ray diffraction is a well suited technique for mapping the strain/stress tensor of these damaged structures, which can be used to measure the deformation of thin film buckling induced by compressive stresses.
Journal ArticleDOI
Mapping of changes in microscopic strain in Alloy 600 during multi-step applications of mechanical stress
TL;DR: In this article, an Alloy 600 C-ring has been sequentially stressed as in a classical deformation test, and the apex of the C ring has been spatially mapped by Laue microdiffraction during the stress deflection sequence.
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