Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films.
Nobumichi Tamura,Alastair A. MacDowell,Ralph Spolenak,B. C. Valek,John C. Bravman,W. L. Brown,Richard Celestre,Howard A. Padmore,B. W. Batterman,J. R. Patel +9 more
TLDR
Scanning X-ray microdiffraction (microSXRD) combines the use of high-brilliance synchrotron sources with the latest achromaticX-ray focusing optics and fast large-area two-dimensional-detector technology to study thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments.Abstract:
Scanning X-ray microdiffraction (µSXRD) combines the use of high-brilliance synchrotron sources with the latest achromatic X-ray focusing optics and fast large-area two-dimensional-detector technology. Using white beams or a combination of white and monochromatic beams, this technique allows for the orientation and strain/stress mapping of polycrystalline thin films with submicrometer spatial resolution. The technique is described in detail as applied to the study of thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments. It is shown that there are significant orientation and strain/stress variations between grains and inside individual grains. A polycrystalline film when investigated at the granular (micrometer) level shows a highly mechanically inhomogeneous medium that allows insight into its mesoscopic properties. If the µSXRD data are averaged over a macroscopic range, results show good agreement with direct macroscopic texture and stress measurements.read more
Citations
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Journal ArticleDOI
Combining grazing incidence X-rays and micro-diffraction for qualitative phase identification in forensic powdered micro-samples.
TL;DR: In this paper, a few micrograms of typical forensic samples are analyzed using standard Bragg-Brentano, Xray powder diffraction geometry, and grazing incidence X-ray micro-diffraction (GIµXRD).
Book ChapterDOI
Indentation Size Effects in Single Crystal Copper as Revealed by Synchrotron X-ray Microdiffraction
TL;DR: Feng et al. as discussed by the authors found that the hardness increases dramatically with decreasing indentation size, a "smaller is stronger" phenomenon, which is attributed to the existence of strain gradients and the geometrically necessary dislocations (GNDs).
Microstructure of 100 nm damascene copper overburden and lines studied by electron backscatter diffraction
Roy H. Geiss,David T. Read +1 more
TL;DR: In this paper, electron backscatter diffraction was used to compare structures for the pads and 100-nm lines in two variants of a commercial copper damascene interconnect structure.
Journal ArticleDOI
Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis
TL;DR: In this paper, a finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns.
References
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Journal ArticleDOI
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