R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
Papers
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Journal ArticleDOI
Modeling and validation of ESR and frequency-stability of high-density nanostructured capacitors for embedded power converters
Robert Grant Spurney,Himani Sharma,Markondeya Raj Pulugurtha,Markondeya Raj Pulugurtha,Rao Tummala,Naomi Lollis,Mitch Weaver,Saumya Gandhi,Matthew D. Romig,Holger Brumm +9 more
TL;DR: In this paper, the relationship between capacitor nanostructure and electrical performance is investigated, and the model is then used to study the effect of capacitor materials and device geometry on the device performance, including capacitance density, frequency stability and ESR.
Proceedings Article
Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech
TL;DR: The Georgia Tech team proposes a transformative and yet a strategic approach to automotive electronics, called System Scaling, leading to entire automotive system-on-a package, which is superior to current approaches such as chip-first or wafer fanout or chip-last organic, leadframe and molded packaging technologies.
Book ChapterDOI
st Polymers for electronic packaging in the 21 century
C.P. Wong,Rao Tummala +1 more
TL;DR: In this article, Nanostructure air gap ultra-low dielectrics are developed for high frequency (in excess of 100 GHz for wireless and portable products), which are described in this chapter.
Proceedings ArticleDOI
Ultra-thin and ultra-high I/O density package-on-package (3D Thin PoP) for high bandwidth of smart systems
TL;DR: 3D Thin PoP as mentioned in this paper is a more advanced 3D POP designed to achieve ultra-thin stacked packages in 3D with higher chip-to package and package-to-package I/Os to achieve higher bandwidth.
Patent
Material and process set for fabrication of molecular matrix print head
TL;DR: In this article, a method for fabricating a molecular matrix print head for use in nonimpact electrolytic printers is described, where green ceramic sheets are stacked and laminated, then embossed with insulators and screened with ruthenium dioxide.