Rao Tummala

TL;DR: In this article, a cavity is provided that is defined by the first substrate and its corresponding one or more laminates and at least one inner lateral portion, which is operable to receive microelectromechanical system (MEMS) components.

TL;DR: In this paper, a high-performance interfill material based on epoxy resin is used to connect the different chip sector macros that make up the system chip, which remains thermally stable through the subsequent processing temperature hierarchies during the interchip interconnection fabrication.

TL;DR: Ceramics, both crystalline and amorphous, as used today for such applications as processing, tranferring, storing, printing and displaying information are reviewed in this paper.

TL;DR: In this article, a systematic modeling and experimental study of sub-5-μm -diameter microvia reliability is presented, for the first time, and experimental thermal-cycling reliability results are correlated with the modeling results.

TL;DR: In this article, a fast, non-destructive, sensitive, and real-time technique for detailed investigation of the propagation properties of planar optical waveguides is presented, where a high sensitive CCD camera with a built-in integration function is utilized to observe the light streak in two dimensions through a two lens imaging system.