Rao Tummala

TL;DR: In this paper, multilayered shielding topologies with electrically conductive and nanomagnetic materials were modeled, designed, fabricated, and characterized to create high shielding effectiveness in the frequency range of 1MHz to 100MHz.

TL;DR: This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.

TL;DR: This paper presents, for the first time, a non-TSV based 3D architecture using Glass Panel Embedding (GPE) technology for high-density large package applications achieving excellent bandwidth and power-efficiency that are not possible in current approaches.

TL;DR: In this article, a glass interposer electromagnetic bandgap (EBG) structure was proposed to suppress power/ground noise coupling in a power distribution network with high-speed TGV channel.

TL;DR: In this article, a novel coelectrodeposition process was explored to form composite solder thin films as advanced bonding layers with potentially superior thermal and mechanical properties, where the solder electrolyte was modified with SiC and graphite particles to electroplate the solder composite films.