R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
Papers
More filters
Proceedings ArticleDOI
Low cost, high performance, and high reliability 2.5D silicon interposer
Venky Sundaram,Qiao Chen,Tao Wang,Hao Lu,Yuya Suzuki,Vanessa Smet,Makoto Kobayashi,Raj Pulugurtha,Rao Tummala +8 more
TL;DR: In this article, the authors demonstrate polycrystalline silicon interposers with fine pitch through package vias (TPV), with less than 5μm RDL lithography at 50μm pitch copper microbump assembly.
Journal ArticleDOI
Processing and Dielectric Properties of Nanocomposite Thin Film “Supercapacitors” for High-Frequency Embedded Decoupling
Pulugurtha Markondeya Raj,Devarajan Balaraman,V. Govind,I.R. Abothu,Lixi Wan,Rosario A. Gerhardt,Madhavan Swaminathan,Rao Tummala +7 more
TL;DR: In this article, the high-frequency dielectric properties of carbon black-epoxy nanocomposites were evaluated with a multiline calibration technique by measuring -parameters of transmission lines fabricated on the top of the dielectrics.
Journal ArticleDOI
Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules
Srikrishna Sitaraman,Vijay Sukumaran,Markondeya Raj Pulugurtha,Zihan Wu,Yuya Suzuki,Youngwoo Kim,Venky Sundaram,Joungho Kim,Rao Tummala +8 more
TL;DR: In this paper, an innovative and miniaturized thin-film bandpass filter with coupled spiral structures in ultrathin glass substrates was proposed for two applications: 3D integrated passive devices and embedded thinfilm filters in RF modules.
Proceedings ArticleDOI
Multi-layer fully organic-based system on package (SOP) technology for RF applications
TL;DR: In this paper, the authors present the development and characterization of multi-layer fully organic-based system-on-package (SOP) technology, referred to as the single level integrated module (SLIM), for RF applications.
Patent
Glass-polymer optical interposer
TL;DR: An optical interposer as discussed by the authors includes a glass substrate (102) having one or more optical vias (104) extending through the glass substrate, and a first optical polymer (112) may be bonded to the substrate and to the interior surfaces of the one or multiple optical Vias.