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Rao Tummala

Researcher at Georgia Institute of Technology

Publications -  628
Citations -  12781

Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.

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Patent

Systems and methods for fabricating high-density capacitors

MarkondeyaRaj Pulugurtha, +6 more
TL;DR: In this paper, the authors describe systems and methods for fabricating high-density capacitors, including the steps of providing a substrate and depositing a nanoelectrode particulate paste layer onto the substrate.
Proceedings ArticleDOI

Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly

Ting-Chia Huang, +5 more
TL;DR: In this paper, an innovative SLID concept, consisting of isolating a metastable intermetallic phase between barrier layers for a faster conversion to metastable composition than that in traditional SLID, was introduced.
Journal ArticleDOI

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Qiao Chen, +4 more
- 02 Oct 2014 - 
TL;DR: In this article, a double-side process was proposed to fabricate TSVs for passive interposer applications, which significantly reduces the fabrication process steps compared with a traditional TSV.
Proceedings ArticleDOI

Next Generation of Automotive Radar with Leading-Edge Advances in SiGe Devices and Glass Panel Embedding (GPE)

Tailong Shi, +5 more
TL;DR: In this paper, the design and process building blocks for an ultra-miniaturized automotive radar module were demonstrated with the most leading-edge SiGe devices operating at 77 GHz and 3D glass panel embedded (GPE) package.
Journal ArticleDOI

Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Nitesh Kumbhat, +5 more
- 01 May 2012 - 
TL;DR: In this article, an innovative and manufacturable solution to achieve excellent reliability at Ultrafine pitch (~30 μm) using direct copper-copper (Cu-Cu) interconnections with adhesives was demonstrated.