R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
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Journal ArticleDOI
Design, Modeling, Fabrication and Characterization of 2–5- $\mu \text{m}$ Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers
TL;DR: In this paper, a modified low-cost semi-additive process (SAP) method with newly developed differential seed layer etching was employed to fabricate the fine line and space patterns and coplanar waveguide (CPW) transmission on thin glass panels.
Proceedings ArticleDOI
Chip-last Embedded Active for System-On-Package (SOP)
TL;DR: The detailed process development for the first prototype of chip-last embedded active is described, which is proposed to address some of process and reliability issues that current chip-first and chip-middle embedded active approaches have.
Proceedings ArticleDOI
RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology
M.F. Davis,A. Sutono,Kyutae Lim,J. Laskar,Venky Sundaram,J.M. Hobbs,George White,Rao Tummala +7 more
TL;DR: In this paper, a fully organic multi-layer interconnects and integrated passives for RF and microwave system-on-package (SOP) development are presented, which include novel CPW-microstrip transitions, high Q passives, as well as a planar antenna on a package.
Journal ArticleDOI
Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications
Tong-Hong Lin,Kimiyuki Kanno,Atom Watanabe,Pulugurtha Markondeya Raj,Rao Tummala,Madhavan Swaminathan,Manos M. Tentzeris +6 more
TL;DR: The monopole taper radiator is adopted for the proposed Yagi antenna design to miniaturize the size, extend the bandwidth, and simplify the feeding network, and the proposed AiP design is broadband enough to cover all three 5G New Radio bands simultaneously.
Proceedings ArticleDOI
Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
Nitesh Kumbhat,Abhishek Choudhury,Melanie Raine,G. Mehrotra,P. Markondeya Raj,Rongwei Zhang,Kyoung S. Moon,Ritwik Chatterjee,Venky Sundaram,Georg Meyer-Berg,C.P. Wong,Rao Tummala +11 more
TL;DR: In this article, a novel interconnection solution with excellent reliability for ultra-fine pitch (∼30µm) silicon (Si) on organic first level interconnections by using copper (Cu) pillar with nano-anisotropic conductive film (nano-ACF)/non conductive Film (NCF) was presented.