Rao Tummala

TL;DR: Material and process issues for passive elements such as resistors, capacitors, and inductors and the need for developing alternative substrate materials have been addressed in this paper.

TL;DR: In this article, a glass interposer was proposed as a superior alternative interposers technology to address the limitations of both silicon and organic interposition technology, where the inherent electrical properties of glass, together with large area panel size availability, make it superior compared to organic and silicon-based interposERS.

TL;DR: In this paper, an accurate electrical modeling of TSVs considering metal-oxide-semiconductor (MOS) capacitance effects is presented, which is correlated with measurement results for validation.

TL;DR: In this paper, the design, materials, fabrication and measurements of a novel integrated decoupling capacitor for MCM-L-based substrates are discussed, with diameters of 100 um and below, through photodefinable processes.

TL;DR: A double-sided and ultrathin 3D glass interposer with through package vias at same pitch as through silicon vias in silicon interposers is developed to provide a compelling alternative to 3-D IC stacking of logic and memory devices with TSVs as discussed by the authors.