Rao Tummala

TL;DR: In this article, the authors reported the integration of hydrothermal barium titanate thin film embedded capacitors in organic printed wiring boards for simultaneous switching noise suppression, a clock distribution network was designed using a clock driver with one input and four differential outputs.

TL;DR: In this article, the authors presented the first demonstration of an ultra-thin glass BGA package that is assembled on to a mother board with standard SMT technology such as double-side RDL wiring with advanced 3 micron ground rules, and microbump assembly of a 10mm silicon test die.

TL;DR: In this paper, a nanoscale semiconducting ZnO based biosensor with integrated microfluidics is designed, fabricated and tested to demonstrate the detection of streptavidin, a commonly used protein.

TL;DR: In this paper, a drop-test reliability performance of large, ultra-thin glass BGA packages that are directly mounted onto the system board, unlike the current approach of flip-chip assembly of interposers, involving additional organic packages which are then SMT assembled onto boards.

TL;DR: In this article, the role of warpage on future high density wiring requirements is investigated and the impact of the gap between mask and the substrate arising out of war page on the width of fine lines is shown.