R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
Papers
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Proceedings ArticleDOI
Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications
Nitesh Kumbhat,Pulugurtha Markondeya Raj,R.V. Pucha,S. Atmur,R. Doraiswamy,V. Sundaram,Shiv Sankar Bhattacharya,Suresh K. Sitaraman,Rao Tummala +8 more
TL;DR: In this paper, a large-area carbon-silicon carbide (C-SiC) based composite board material was evaluated for high-stiffness low-CTE and high-density wiring on the board.
Proceedings ArticleDOI
Robust extraction of the frequency-dependent characteristic impedance of transmission lines using one-port TDR measurements
TL;DR: In this paper, a method for extracting the frequency dependent characteristic impedance of transmission lines from Time Domain Reflectometry (TDR) measurements using an Open, Short, Load, and Shortline calibration was proposed.
Patent
Reactively formed integrated capacitors on organic substrates and fabrication methods
TL;DR: In this paper, organic-compatible thin film processing techniques with reactive (such as Ti) layers for embedding capacitors into substrates have been discussed, and a reaction with the intermediate layer and a foil transfer process may be used to integrate perovskite thin films with a capacitance in the range of 1-5 μF/cm 2.
Proceedings ArticleDOI
Interconnection materials, processes and tools for fine-pitch panel assembly of ultra-thin glass substrates
Vanessa Smet,Ting-Chia Huang,Satomi Kawamoto,Bhupender Singh,Venky Sundaram,Markondeya Raj Pulugurtha,Rao Tummala +6 more
TL;DR: In this article, a set of no-flow snap-cure underfill materials with high thermal stability, beyond existing conductive films or pastes, was developed in synergy with tools and processes for compatibility with advanced substrate technologies.
Proceedings ArticleDOI
Thin film power components with nanoscale electrodes and conformal dielectrics
TL;DR: In this article, the first proof-of-concept demonstration of a novel silicon-compatible high-density capacitor technology was reported, where the key novelty stems from the tremendous enhancement in surface area from porous copper nanoelectrodes and conformal alumina dielectric.