Institution
Teradyne
Company•Boston, Massachusetts, United States•
About: Teradyne is a company organization based out in Boston, Massachusetts, United States. It is known for research contribution in the topics: Signal & Automatic test equipment. The organization has 828 authors who have published 999 publications receiving 15695 citations.
Topics: Signal, Automatic test equipment, Device under test, Printed circuit board, Interface (computing)
Papers published on a yearly basis
Papers
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15 Sep 2010TL;DR: In this paper, the authors propose a test system that provides an output signal for analysis without requiring the test hardware to be idle during a settling interval, where the test system includes a preprocessor that identifies the near-DC drift that occurs in the output signal.
Abstract: A test system that provides an output signal for analysis without requiring the test hardware to be idle during a settling interval. The test system includes a preprocessor that identifies the near-DC drift that occurs in the output signal and then adjusts the output signal to remove the near-DC drift. A set of values representing the near-DC drift at each of multiple times during the acquisition of a signal for analysis may be computed and used to model a settling profile of the signal by fitting a curve to the set of values. The model of the settling profile may then be subtracted from samples representing the output signal to provide an adjusted signal for further analysis.
5 citations
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09 Feb 2000TL;DR: In this article, a differential comparator is disclosed including first and second input amplifier circuits, and a reference signal circuitry is coupled to the inputs to produce a predetermined reference signal for comparison to the difference signal.
Abstract: A differential comparator is disclosed including first and second input amplifier circuits. The input amplifier circuits have respective signal input terminals for receiving respective first and second complementary input signals and respective output terminals. The first and second input amplifier circuits cooperate to produce a difference signal. Reference signal circuitry is coupled to the input amplifier circuits and is operative to produce a predetermined reference signal for comparison to the difference signal. The input amplifier circuits and the reference signal circuitry cooperate to define a single stage.
5 citations
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01 Nov 2018TL;DR: In this article, an example system includes capture circuitry to obtain first parametric data based on a first signal at an interface to a first communication channel, and control circuitry to receive the first parameterized data and to provide second parametric information based on one or both of: the firstparametric data or programmatic input.
Abstract: An example system includes capture circuitry to obtain first parametric data based on a first signal at an interface to a first communication channel, with the first parametric data representing non-informational content of the first signal; and control circuitry to receive the first parametric data and to provide second parametric data, the second parametric data being based on one or both of: the first parametric data or a programmatic input. The example system also includes interface circuitry to receive the second parametric data and to receive informational content data representing informational content, and to process the informational content data and the second parametric data to produce a second signal. The second signal has the informational content represented by the informational content data and having at least some non-informational content based on the second parametric data.
5 citations
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10 Nov 2014TL;DR: In this article, the dice are placed in a pattern on a second wafer, where the second Wafer has a coefficient of thermal expansion that has substantially the same coefficient as the dice.
Abstract: An example process places dice that have been cut from a first semiconductor wafer on a second wafer. The example process includes arranging the dice in a pattern on a the second wafer, where the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice; and using a probe card that is matched to a pattern of dice in connection with the second wafer.
5 citations
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28 Oct 2010TL;DR: This paper details the on-board JTAG programming of a Flash Memory using typical digital test instrumentation found in test systems rather than various boundary scan vendor proprietary hardware.
Abstract: This paper details the on-board JTAG programming of a Flash Memory using typical digital test instrumentation found in test systems rather than various boundary scan vendor proprietary hardware. Advantages to this technique, such as reduction in required equipment and reduced integration and support costs, are discussed.
5 citations
Authors
Showing all 830 results
Name | H-index | Papers | Citations |
---|---|---|---|
John H. Lienhard | 68 | 419 | 18058 |
Todd Austin | 55 | 167 | 20607 |
Alexander H. Slocum | 44 | 449 | 9393 |
Scott C. Noble | 30 | 98 | 3495 |
D. R. LaFosse | 26 | 139 | 2555 |
Tongdan Jin | 26 | 113 | 2326 |
Thomas S. Cohen | 24 | 37 | 2490 |
Mark W. Gailus | 21 | 54 | 1851 |
R. Ryan Vallance | 20 | 87 | 1081 |
Richard F. Roth | 18 | 37 | 1104 |
Sepehr Kiani | 15 | 28 | 672 |
Frank W. Ciarallo | 14 | 44 | 1066 |
Brian S. Merrow | 14 | 34 | 621 |
Philip T. Stokoe | 13 | 26 | 1238 |
Ernest P. Walker | 12 | 22 | 252 |