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Journal ArticleDOI

Evidence of Hot-Electron Effects During Hard Switching of AlGaN/GaN HEMTs

TLDR
The results demonstrate that the analyzed devices do not suffer from dynamic ON-resistance problems, and the impact of hard switching on dynamic <inline-formula> becomes weaker at high-temperature levels, as the average energy of hot electrons decreases due to the increase scattering with the lattice.
Abstract
This paper reports on the impact of soft- and hard-switching conditions on the dynamic ON-resistance of AlGaN/GaN high-electron mobility transistors. For this study, we used a special double pulse setup, which controls the overlapping of the drain and gate waveforms (thus inducing soft and hard switching), while measuring the corresponding impact on the ON-resistance, drain current, and electroluminescence (EL). The results demonstrate that the analyzed devices do not suffer from dynamic ${R}_{ {\mathrm{\scriptscriptstyle ON}}}$ increase when they are submitted to soft switching up to ${V}_{{\text {DS}}}= 600$ V. On the contrary, hard-switching conditions lead to a measurable increase in the dynamic ON-resistance (dynamic- ${R}_{ \mathrm{\scriptscriptstyle ON}})$ . The increase in dynamic ${R}_{ \mathrm{\scriptscriptstyle ON}}$ induced by hard switching is ascribed to hot-electrons effects: during each switching event, the electrons in the channel are accelerated by the high electric field and subsequently trapped in the AlGaN/GaN heterostructure or at the surface. This hypothesis is supported by the following results: 1) the increase in ${R}_{ \mathrm{\scriptscriptstyle ON}}$ is correlated with the EL signal measured under hard-switching conditions and 2) the impact of hard switching on dynamic ${R}_{ \mathrm{\scriptscriptstyle ON}}$ becomes weaker at high-temperature levels, as the average energy of hot electrons decreases due to the increase scattering with the lattice.

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Journal ArticleDOI

GaN-based power devices: Physics, reliability, and perspectives

TL;DR: In this article, the authors describe the physics, technology, and reliability of GaN-based power devices, starting from a discussion of the main properties of the material, the characteristics of lateral and vertical GaN transistors are discussed in detail to provide guidance in this complex and interesting field.
Journal ArticleDOI

Dynamic On-Resistance in GaN Power Devices: Mechanisms, Characterizations, and Modeling

TL;DR: An overview and discussion of the mechanisms, characterizations, modeling, and solutions for the degradation of dynamic on-resistance in GaN power devices is presented and a behavioral model with the dynamic degradation taken into consideration has been implemented for circuit analysis.
Journal ArticleDOI

Emerging GaN technologies for power, RF, digital, and quantum computing applications: Recent advances and prospects

TL;DR: In this article, the authors provide a glimpse of future GaN device technologies and advanced modeling approaches that can push the boundaries of these applications in terms of performance and reliability, which is a key missing piece to realize the full GaN platform with integrated digital, power, and RF electronics technologies.
Journal ArticleDOI

Dynamic on -Resistance in GaN-on-Si HEMTs: Origins, Dependencies, and Future Characterization Frameworks

TL;DR: In this paper, the authors used the double-pulse-test (DPT) method to estimate conduction losses in converters with GaN HEMTs and found that the worst-case dc resistance is nearly two times higher than the dc resistance at the same temperature.
Journal ArticleDOI

Active Power Device Selection in High- and Very-High-Frequency Power Converters

TL;DR: In this paper, the authors provide a road map for selecting power devices in soft-switched, megahertz (MHz) frequency power converters, and demonstrate a 100 W, 17 MHz dc-RF inverter using a custom-packaged silicon carbide (SiC) power mosfet s.
References
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Journal ArticleDOI

Vertical Leakage/Breakdown Mechanisms in AlGaN/GaN-on-Si Devices

TL;DR: In this article, the vertical leakage/breakdown mechanisms in AlGaN/GaN high-electron-mobility transistors grown on low-resistivity p-type (111) Si substrate are studied by temperature-dependent current-voltage (I-V) measurements.
Journal ArticleDOI

Investigation of Trapping and Hot-Electron Effects in GaN HEMTs by Means of a Combined Electrooptical Method

TL;DR: In this article, the role of traps in limiting the maximum gate-drain electric field and the equivalent electron temperature in GaN-based high-electron mobility transistors is investigated.
Journal ArticleDOI

Reliability and parasitic issues in GaN-based power HEMTs: a review

TL;DR: In this paper, the authors review the parasitic mechanisms that affect the performance of GaN-on-Si HEMTs and describe the following relevant processes: (i) trapping of electrons in the buffer, induced by off-state operation; (ii) trapping hot electrons, which is promoted by semi-on state operation; and (iii) trapping, in the gate insulator, favored by the exposure to positive gate bias.
Proceedings ArticleDOI

On the impact of carbon-doping on the dynamic Ron and off-state leakage current of 650V GaN power devices

TL;DR: In this article, a strong positive correlation between dynamic Ron and the ionization of buffer traps by injection of electrons from the Si substrate is presented, which in turn results in lower dynamic Ron.
Proceedings ArticleDOI

Product-level reliability of GaN devices

TL;DR: This paper explains how hard-switching can form a fundamental switching transition for power management products and shows that the familiar double-pulse tester is a good hard- Switched qualification test vehicle.
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