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Journal ArticleDOI

Metal Carbides for Band-Edge Work Function Metal Gate CMOS Devices

TLDR
In this paper, various metal carbides (TaC, HfC, WC, and VC) were thoroughly investigated for metal gate CMOS devices with band-edge work functions (WFs).
Abstract
Various metal carbides (TaC, HfC, WC, and VC) were thoroughly investigated for metal gate CMOS devices with band-edge work functions (WFs). It is found that TaC and HfC are more suitable for the CMOS device application among the various metal carbides. HfC is demonstrated to be a good candidate for NMOS because of its low WF and excellent thermal stability, while TaC Al shows a high WF and good thermal stability suitable for PMOS device application. In addition, HfC and TaC have a wide range of WF tunability using thin LaN and AlN interlayer or introduction of La and Al into the metal carbides.

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Journal ArticleDOI

Transistors with Chemically Synthesized Layered Semiconductor WS2 Exhibiting 105 Room Temperature Modulation and Ambipolar Behavior

TL;DR: In this paper, the authors reported the realization of field effect transistors (FETs) made with chemically synthesized layered two dimensional (2D) crystal semiconductor WS2, which demonstrated ambipolar behavior and a high (~105x) on/off current ratio at room temperature with current saturation.
Journal ArticleDOI

Transistors with chemically synthesized layered semiconductor WS2 exhibiting 105 room temperature modulation and ambipolar behavior

TL;DR: In this article, the authors reported the realization of field effect transistors (FETs) made with chemically synthesized multilayer crystal semiconductor WS2, which demonstrated ambipolar behavior and a high (∼105×) on/off current ratio at room temperature with current saturation.
Journal ArticleDOI

Thermal Atomic Layer Etching of Titanium Nitride Using Sequential, Self-Limiting Reactions: Oxidation to TiO2 and Fluorination to Volatile TiF4

TL;DR: The thermal atomic layer etching (ALE) of TiN was demonstrated using a new etching mechanism based on sequential, self-limiting oxidation and fluorination reactions as discussed by the authors, where the oxidant was either O3 or H2O2, and the fluorination reactant was hydrogen fluoride (HF) derived from HF-pyridine.
Journal ArticleDOI

The Work Function Behavior of Aluminum-Doped Titanium Carbide Grown by Atomic Layer Deposition

TL;DR: In this article, the effective work function (eWF) of Al-doped titanium carbide (TiAlC) metal electrodes prepared by atomic layer deposition showed a strong dependence on the underlying gate dielectrics.
Journal ArticleDOI

Stacked sputtering process for Ti, Ta, and W carbide formation for gate metal application

TL;DR: In this paper, a sputtering process using multi-stacking of carbon and metal thin films with subsequent annealing process to reactively form metal carbides (TiC, TaC, and W2C) has been presented.
References
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Book

Binary alloy phase diagrams

TL;DR: Binary Alloy Phase Diagrams, Second Edition, Plus Updates, on CD-ROM offers you the same high-quality, reliable data you'll find in the 3-volume print set published by ASM in 1990.
Book

Handbook of Refractory Carbides and Nitrides: Properties, Characteristics, Processing and Applications

TL;DR: The Refractory Nitrides Interstitial Carbides, Structure and Composition Carbides of Group IV: Titanium, Zirconium, and Hafnium Carbides.
Proceedings ArticleDOI

Challenges for the integration of metal gate electrodes

TL;DR: In this article, the integration challenges for metal gate electrodes including the presence of Fermi level pinning and the impact of interface chemistry on the effective metal work function are discussed.
Journal ArticleDOI

Investigation of etching properties of metal nitride/high-k gate stacks using inductively coupled plasma

TL;DR: In this paper, the authors investigated the etch properties of metal nitrides (TaN, TiN, and HfN)/high dielectric constant material (HfO2) gate stacks in Cl2 and HBr using inductively coupled plasma.
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